Transient Characteristics of a Two-Phase Thermosyphon Loop for Multichip Module

ETRI Journal

Volumn 20, Issue 3, 1998, Pages 284-299

  Nam, Sang Sig ^a   Choi, Sung Bong ^a   Kim, Jae Hee ^a   Kwak, Ho Young ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

COOLING SYSTEMS; ELECTRONICS PACKAGING; HEAT FLUX;

INTEGRATED CONDENSERS;

MULTICHIP MODULES;

EID: 0032163130     PISSN: 12256463     EISSN: None     Source Type: Journal    
DOI: 10.4218/etrij.98.0198.0303     Document Type: Article

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