Experimental investigation of the thermal performance of graphite foam for evaporator Enhancement in Both Pool Boiling and an FC-72 Thermosyphon

Heat Transfer Engineering

Volumn 30, Issue 8, 2009, Pages 643-648

  Gandikota, Venugopal ^a   Fleischer, Amy S ^a  

^a Villanova University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPILLARY FLOW; GRAPHITE; HEAT FLUX; HEAT TRANSFER; MIXED CONVECTION; SIPHONS;

EXPERIMENTAL INVESTIGATIONS; FLUID LEVELS; FOAM HEAT SINKS; GRAPHITE FOAMS; HEAT LOADS; HIGH HEAT FLUXES; POOL BOILING; SURFACE ENHANCEMENTS; THERMAL MANAGEMENTS; THERMAL PERFORMANCE; THERMAL RESISTANCES; THERMOSYPHON;

HEAT RESISTANCE;

EID: 61449096908     PISSN: 01457632     EISSN: 15210537     Source Type: Journal    
DOI: 10.1080/01457630802659862     Document Type: Article

References (9)

1. Palm, B., and Tengblad, N., Cooling of Electronics by Heat Pipes and Thermosyphons: A Review of Methods and Possibilities, Proc. ASME National Heat Transfer Conference, vol. HTD-329, pp. 97-108, 1996.
2. Gima, S., Tomimura, T., Zhang, X., and Fuji, M., An Experimental Study on Liquid Cooling of High Power IC Chips, Advances in Electronic Packaging, vol. EEP-26(2), pp. 1479-1484, 1999.
3. Na, M.-K., Jeon, J.-S., and Kwak, H.-Y, Experimental Study on Closed-Loop Two-Phase Thermosyphon Devices For Cooling MCMs, Heat Transfer Engineering, vol. 22(2), pp. 29-39, 2001.
4. Mudawar, I., and Anderson, T. M., Optimization of Enhanced Surfaces for High Flux Chip Cooling by Pool Boiling, Journal of Electronic Packaging, vol. 115, pp. 89-100, 1993.
5. Rainey, K. N., and You, S. M., Pool Boiling Heat Transfer from Plain and Microporous Square Pin-Finned Surfaces in Saturated FC-72, Journal of Heat Transfer, vol. 122, pp. 509-516, 2000.
6. Klett, J. W., and Trammell, M., Parametric Investigation of a Graphite Foam Evaporator in a Thermosyphon with Fluorinert and a Silicon CMOS Chip, IEEE Transactions on Device and Materials Reliability, vol. 4(3), pp. 626-637, 2004.
7. Coursey, J. S., Kim, J., and Boudreaux, P. J., Performance of Graphite Foam Evaporator for Use in Thermal Management, Journal of Electronic Packaging, vol. 127, pp. 127-134, 2005.
8. Chen, T., and Garimella, S. V., Effects of Dissolved Air on Subcooled Flow Boiling of Dielectric Cooling in a Micro Channel Heat Sink, Paper ICMM 2005-75157, Proceedings OF ICMM2005, 3rd International Conference on Microchannels and Minichannels, Toronto, Canada, June 13-15, 2005.
9. Kline, S. J., and McClintock, F. A., Describing Uncertainty in Single-Sample Experiments, Mechanical Engineering, vol. 75, pp. 3-8, 1953.