Thermal characteristics of two phase thermosyphon cooling module for multi-chip device

American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD

Volumn 338, Issue , 1996, Pages 33-38

  Choi, Sung Bong ^a   Nam, Sang Sig ^b   Kim, Jae Hee ^c   Kwak, Ho Young ^c  

^a Research Institute   (South Korea)

^b Electronics and Telecommunications Research Institute (ETRI)   (South Korea)

^c Chung Ang University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CHANNEL FLOW; CONDENSERS (LIQUEFIERS); FABRICATION; HEAT FLUX; MULTICHIP MODULES; PERFORMANCE; THERMAL EFFECTS; THERMAL LOAD;

COLD PLATE; THERMOSYPHONIC COOLING MODULE;

COOLING SYSTEMS;

EID: 0030421140     PISSN: 02725673     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (10)

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