Temperature dependence of the sticking coefficient in atomic layer deposition

Applied Surface Science

Volumn 256, Issue 12, 2010, Pages 3778-3782

  Rose, M ^a   Bartha, J W ^b   Endler, I ^a  

^a FRAUNHOFER INSTITUTE FOR CERAMIC TECHNOLOGIES AND SYSTEMS   (Germany)

^b DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Atomic layer deposition; Deep trench; Simulation; Sticking coefficient; TEMAHf; Temperature dependence

Indexed keywords

ACTIVATION ENERGY; ATOMS; HAFNIUM OXIDES; MOLECULES; TEMPERATURE DISTRIBUTION; TITANIUM DIOXIDE;

DEEP TRENCH; SIMULATION; STICKING COEFFICIENTS; TEMAHF; TEMPERATURE DEPENDENCE;

ATOMIC LAYER DEPOSITION;

EID: 77649237217     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2010.01.025     Document Type: Article

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