Correlations between mechanical stress, electrical conductivity and nanostructure in Al films on a polymer substrate

Materials Characterization

Volumn 61, Issue 3, 2010, Pages 325-329

  Bautista, J R ^a   Aviles F ^a   Oliva, A I ^b   Ceh, O ^b   Corona, J E ^b  

^a CENTRO DE INVESTIGACIÓN CIENTÍFICA DE YUCATÁN   (Mexico)

^b DEPARTAMENTO DE FÍSICA APLICADA   (Mexico)

Author keywords

Aluminum; Electrical resistivity; Mechanical behavior; Nanostructure; Thin films

Indexed keywords

AL FILMS; ALUMINUM FILM; ELECTRICAL CONDUCTIVITY; ELECTRICAL RESISTIVITY; FILM GRAIN; FILM NANOSTRUCTURES; FILM SURFACES; MECHANICAL BEHAVIOR; MECHANICAL FAILURES; MECHANICAL STRESS; NANOSTRUCTURAL; NANOSTRUCTURE THIN FILMS; POLYMER SUBSTRATE;

ALUMINUM; ALUMINUM COATINGS; ELECTRIC CONDUCTIVITY; FILM GROWTH; GRAIN GROWTH; MECHANICAL ENGINEERING; METALLIC FILMS; NANOSTRUCTURES; POLYMER FILMS; THIN FILMS;

STRESSES;

EID: 77549088121     PISSN: 10445803     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchar.2009.12.016     Document Type: Article

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