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Volumn 116, Issue 4, 2010, Pages 2348-2358

A study of critical processing technologies of liquid crystal polymer printed circuit board for high speed application

Author keywords

Liquid crystal polymer; Printed circuit board; Process technology

Indexed keywords

ADVANCED MATERIALS; DIFFERENT PROCESS; FABRICATION TECHNOLOGIES; HIGH FREQUENCY HF; HIGH TEMPERATURE RESISTANCE; HIGH-SPEED APPLICATIONS; HIGH-SPEED SIGNALS; MARKET DEMAND; MATERIAL CHARACTERISTICS; METALLIZATIONS; MOISTURE ABSORPTION; PCB PROCESS; PROCESS TECHNOLOGIES; PROCESS TECHNOLOGY; PROCESSING TECHNOLOGIES; RELIABILITY TESTING; THEORETICAL STUDY; TREATMENT CONDITIONS;

EID: 77449123516     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.31728     Document Type: Article
Times cited : (6)

References (14)
  • 7
    • 77449129189 scopus 로고    scopus 로고
    • Hole preparation and metalization of high aspect ratio-high reliability back panels
    • Carano, M. Hole preparation and metalization of high aspect ratio-high reliability back panels. CircuiTree. 2003. Available at http://www.circuitree. com/Articles/Cover-Story/aa81b155dcfe7010VgnVCM100000f932a8c0-.
    • (2003) CircuiTree
    • Carano, M.1
  • 13
    • 77449133079 scopus 로고
    • Round robin reliability evaluation of small diameter plated through holes in printed circuit boards, IPC TR-579
    • IPC Technical Report. Round robin reliability evaluation of small diameter plated through holes in printed circuit boards, IPC TR-579, 1988.
    • (1988) IPC Technical Report


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.