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Volumn 33, Issue 8, 2007, Pages 954-958

Effects of PWB design factors on PTH reliability

Author keywords

Design parameter; Glass transition temperature; Lifetime; Plated through hole; Reliability

Indexed keywords

ASPECT RATIO; ELECTRIC WIRING; ELECTRON TRANSITIONS; GLASS TRANSITION; STRESS CONCENTRATION; SUPERCONDUCTING TRANSITION TEMPERATURE;

EID: 34948866786     PISSN: 10015965     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (2)

References (8)
  • 1
    • 34948843469 scopus 로고    scopus 로고
    • Predicting plated though hole life and in the field from thermal stress data
    • Los Angeles: The Institute for Interconnecting and Packaging Electronic Circuits
    • Michael F, Donald B. Predicting plated though hole life and in the field from thermal stress data[C]//IPC Printed Circuits Expo, APEX and the Designers Summit. Los Angeles: The Institute for Interconnecting and Packaging Electronic Circuits, 2006: 203-205
    • (2006) IPC Printed Circuits Expo, APEX and the Designers Summit , pp. 203-205
    • Michael, F.1    Donald, B.2
  • 2
    • 34250752799 scopus 로고    scopus 로고
    • A PTH reliability model considering barrel stress distributions and multiple PTHs in a PWB
    • San Jose: IEEE Electron Device Society and IEEE Reliability Society
    • Xie Jingsong, Kang Rui, Zhang Yuan, et al. A PTH reliability model considering barrel stress distributions and multiple PTHs in a PWB[C]//The 44th Annual IEEE International Reliability Physics Symposium. San Jose: IEEE Electron Device Society and IEEE Reliability Society, 2006: 256-265
    • (2006) The 44th Annual IEEE International Reliability Physics Symposium , pp. 256-265
    • Xie, J.1    Kang, R.2    Zhang, Y.3
  • 3
  • 4
    • 0026376187 scopus 로고
    • Predicting plated-through-hole reliability in high temperature manufacturing processes
    • Atlanta: The IEEE Components, Packaging and Manufacturing Technology Society
    • Iannuzzelli R. Predicting plated-through-hole reliability in high temperature manufacturing processes[C]//Proceedings of the 41st Electronic Components and Technology Conference. Atlanta: The IEEE Components, Packaging and Manufacturing Technology Society, 1991: 410-421
    • (1991) Proceedings of the 41st Electronic Components and Technology Conference , pp. 410-421
    • Iannuzzelli, R.1
  • 5
    • 54849347100 scopus 로고    scopus 로고
    • Effect of PWB design factors and glass transition temperature on PTH reliability
    • Washington DC: International Microelectronics and Packaging Society and The Microelectronics Foundation
    • Xie Jingsong, Huo Yujie, Zhang Yuan, et al. Effect of PWB design factors and glass transition temperature on PTH reliability[C]//The 39th International Symposium on Microelectronics. Washington DC: International Microelectronics and Packaging Society and The Microelectronics Foundation, 2006: 534-537
    • (2006) The 39th International Symposium on Microelectronics , pp. 534-537
    • Xie, J.1    Huo, Y.2    Zhang, Y.3
  • 6
    • 0034479504 scopus 로고    scopus 로고
    • A study on reliability modeling for through hole cracking failure in thermal enhanced PBGA laminate
    • Las Vegas: The IEEE Components, Packaging and Manufacturing Technology Society
    • Kobayashi T, Hayashida S. A study on reliability modeling for through hole cracking failure in thermal enhanced PBGA laminate[C]//Electronic Components and Technology Conference. Las Vegas: The IEEE Components, Packaging and Manufacturing Technology Society, 2000: 1658-1660
    • (2000) Electronic Components and Technology Conference , pp. 1658-1660
    • Kobayashi, T.1    Hayashida, S.2
  • 7
    • 34948847013 scopus 로고    scopus 로고
    • Sensitivity analysis for the dependence of PTH fatigue life on PCB design parameters
    • in Chinese
    • Sun Bo, Zhang Shunong, Xie Jingsong. Sensitivity analysis for the dependence of PTH fatigue life on PCB design parameters[J]. Electronics Components and Materials, 2006, 25(9): 60-66 (in Chinese)
    • (2006) Electronics Components and Materials , vol.25 , Issue.9 , pp. 60-66
    • Sun, B.1    Zhang, S.2    Xie, J.3
  • 8
    • 0011785788 scopus 로고
    • Reliability evaluation of small diameter plated through holes in printed wiring boards
    • IPC-TR-579
    • Round R. Reliability evaluation of small diameter plated through holes in printed wiring boards[R]. IPC-TR-579, 1988
    • (1988)
    • Round, R.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.