-
1
-
-
34948843469
-
Predicting plated though hole life and in the field from thermal stress data
-
Los Angeles: The Institute for Interconnecting and Packaging Electronic Circuits
-
Michael F, Donald B. Predicting plated though hole life and in the field from thermal stress data[C]//IPC Printed Circuits Expo, APEX and the Designers Summit. Los Angeles: The Institute for Interconnecting and Packaging Electronic Circuits, 2006: 203-205
-
(2006)
IPC Printed Circuits Expo, APEX and the Designers Summit
, pp. 203-205
-
-
Michael, F.1
Donald, B.2
-
2
-
-
34250752799
-
A PTH reliability model considering barrel stress distributions and multiple PTHs in a PWB
-
San Jose: IEEE Electron Device Society and IEEE Reliability Society
-
Xie Jingsong, Kang Rui, Zhang Yuan, et al. A PTH reliability model considering barrel stress distributions and multiple PTHs in a PWB[C]//The 44th Annual IEEE International Reliability Physics Symposium. San Jose: IEEE Electron Device Society and IEEE Reliability Society, 2006: 256-265
-
(2006)
The 44th Annual IEEE International Reliability Physics Symposium
, pp. 256-265
-
-
Xie, J.1
Kang, R.2
Zhang, Y.3
-
3
-
-
0024176359
-
Mathematical model of a plated-through hole under a load induced by thermal mismatch
-
Mirman B A. Mathematical model of a plated-through hole under a load induced by thermal mismatch[J]. IEEE Transactions on Components, Hybrids and Manufacturing Technology, 1988, 11(4): 506-511
-
(1988)
IEEE Transactions on Components, Hybrids and Manufacturing Technology
, vol.11
, Issue.4
, pp. 506-511
-
-
Mirman, B.A.1
-
4
-
-
0026376187
-
Predicting plated-through-hole reliability in high temperature manufacturing processes
-
Atlanta: The IEEE Components, Packaging and Manufacturing Technology Society
-
Iannuzzelli R. Predicting plated-through-hole reliability in high temperature manufacturing processes[C]//Proceedings of the 41st Electronic Components and Technology Conference. Atlanta: The IEEE Components, Packaging and Manufacturing Technology Society, 1991: 410-421
-
(1991)
Proceedings of the 41st Electronic Components and Technology Conference
, pp. 410-421
-
-
Iannuzzelli, R.1
-
5
-
-
54849347100
-
Effect of PWB design factors and glass transition temperature on PTH reliability
-
Washington DC: International Microelectronics and Packaging Society and The Microelectronics Foundation
-
Xie Jingsong, Huo Yujie, Zhang Yuan, et al. Effect of PWB design factors and glass transition temperature on PTH reliability[C]//The 39th International Symposium on Microelectronics. Washington DC: International Microelectronics and Packaging Society and The Microelectronics Foundation, 2006: 534-537
-
(2006)
The 39th International Symposium on Microelectronics
, pp. 534-537
-
-
Xie, J.1
Huo, Y.2
Zhang, Y.3
-
6
-
-
0034479504
-
A study on reliability modeling for through hole cracking failure in thermal enhanced PBGA laminate
-
Las Vegas: The IEEE Components, Packaging and Manufacturing Technology Society
-
Kobayashi T, Hayashida S. A study on reliability modeling for through hole cracking failure in thermal enhanced PBGA laminate[C]//Electronic Components and Technology Conference. Las Vegas: The IEEE Components, Packaging and Manufacturing Technology Society, 2000: 1658-1660
-
(2000)
Electronic Components and Technology Conference
, pp. 1658-1660
-
-
Kobayashi, T.1
Hayashida, S.2
-
7
-
-
34948847013
-
Sensitivity analysis for the dependence of PTH fatigue life on PCB design parameters
-
in Chinese
-
Sun Bo, Zhang Shunong, Xie Jingsong. Sensitivity analysis for the dependence of PTH fatigue life on PCB design parameters[J]. Electronics Components and Materials, 2006, 25(9): 60-66 (in Chinese)
-
(2006)
Electronics Components and Materials
, vol.25
, Issue.9
, pp. 60-66
-
-
Sun, B.1
Zhang, S.2
Xie, J.3
-
8
-
-
0011785788
-
Reliability evaluation of small diameter plated through holes in printed wiring boards
-
IPC-TR-579
-
Round R. Reliability evaluation of small diameter plated through holes in printed wiring boards[R]. IPC-TR-579, 1988
-
(1988)
-
-
Round, R.1
|