A novel method for sequentially-building multi-layer circuits using LCP laminates, cap-layers and bond plys

Circuit World

Volumn 30, Issue 4, 2004, Pages 40-43

  Roseen, Cliff ^a  

^a Rogers Corp   (United States)

Author keywords

Assembly; Laminates; Printed circuits

Indexed keywords

BOND PLYS; CAP LAYERS; MULTILAYER CIRCUIT BOARDS; SEQUENTIAL MULTILAYER METHOD;

DIELECTRIC FILMS; DIELECTRIC PROPERTIES; ELECTRONICS PACKAGING; ETCHING; LIQUID CRYSTAL POLYMERS; MULTILAYERS; PLASTIC LAMINATES; PRINTED CIRCUIT MANUFACTURE;

PRINTED CIRCUIT BOARDS;

EID: 4344704726     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056120410539902     Document Type: Article

References (0)