-
1
-
-
0347852626
-
-
ABAQUS Hibbit, Karisson & Sorenson, Pawtucket, RI, Version 5.5, 1996
-
ABAQUS Hibbit, Karisson & Sorenson, Pawtucket, RI, Version 5.5, 1996.
-
-
-
-
2
-
-
0021530991
-
Micromechanics of multilayer printed circuit boards
-
L.C. Lee, V.V. Darekar, C.K. Lim, Micromechanics of multilayer printed circuit boards, IBM J. Res. Dev. 28 (1984) 715-732.
-
(1984)
IBM J. Res. Dev.
, vol.28
, pp. 715-732
-
-
Lee, L.C.1
Darekar, V.V.2
Lim, C.K.3
-
3
-
-
0022880549
-
Analysis of long term reliability of plated-through holes in multilayer interconnection boards, Part A: Stress analysis and material characterization
-
K.S. Vecchio, R.W. Hertzberg, Analysis of long term reliability of plated-through holes in multilayer interconnection boards, Part A: stress analysis and material characterization, Microelectronic Reliability 26 (4) (1986) 715-732.
-
(1986)
Microelectronic Reliability
, vol.26
, Issue.4
, pp. 715-732
-
-
Vecchio, K.S.1
Hertzberg, R.W.2
-
5
-
-
0026839534
-
Influence of selected design variables on the thermo-mechanical stress distributions in plated-through-hole structures
-
S.M. Bhandarkar, A. Dasgupta, D.B. Barker, M. Pecht, W. Engelmaier, Influence of selected design variables on the thermo-mechanical stress distributions in plated-through-hole structures, J. Electronic Packaging 114 (1) (1992) 8-13.
-
(1992)
J. Electronic Packaging
, vol.114
, Issue.1
, pp. 8-13
-
-
Bhandarkar, S.M.1
Dasgupta, A.2
Barker, D.B.3
Pecht, M.4
Engelmaier, W.5
-
6
-
-
0026170928
-
Transient thermal stress analysis of a plated through hole subjected to wave soldering
-
D. Barkar, M. Pecht, A. Dasgupta, S. Naqvi, Transient thermal stress analysis of a plated through hole subjected to wave soldering, J. of Electronic Packaging 113 (2) (1991) 149-155.
-
(1991)
J. of Electronic Packaging
, vol.113
, Issue.2
, pp. 149-155
-
-
Barkar, D.1
Pecht, M.2
Dasgupta, A.3
Naqvi, S.4
-
7
-
-
0039297170
-
Effect of processing induced defects on reliability of plated through holes in PWB
-
S. Liu, Y.H. Mei, S.G. Zhou, J.S. Zhu, Effect of processing induced defects on reliability of plated through holes in PWB, Proc. ISHM, 1994.
-
(1994)
Proc. ISHM
-
-
Liu, S.1
Mei, Y.H.2
Zhou, S.G.3
Zhu, J.S.4
-
8
-
-
0027277274
-
Critical plane approaches for multiaxial fatigue damage assessment
-
D.L. McDowell, R. Ellis (Eds.), ASTM STP 1191, American Society for Testing and Materials
-
D.F. Socie, Critical plane approaches for multiaxial fatigue damage assessment, in: D.L. McDowell, R. Ellis (Eds.), Advances in Multiaxial Fatigue, ASTM STP 1191, American Society for Testing and Materials, 1993, pp. 7-36.
-
(1993)
Advances in Multiaxial Fatigue
, pp. 7-36
-
-
Socie, D.F.1
-
9
-
-
0027066363
-
A nonlinear kinematic hardening theory for cyclic thermoplasticity and thermoviscoplasticity
-
D.L. McDowell, A nonlinear kinematic hardening theory for cyclic thermoplasticity and thermoviscoplasticity, Int. J. Plasticity 8 (1992) 695-728.
-
(1992)
Int. J. Plasticity
, vol.8
, pp. 695-728
-
-
McDowell, D.L.1
-
10
-
-
0030379448
-
Thermo-mechanical stress analyses of plated through holes in a PWB using internal state variable constitutive models
-
ASME WAM, Atlantic, GA
-
C. Fu, I.C. Ume, D.L. McDowell, Thermo-mechanical stress analyses of plated through holes in a PWB using internal state variable constitutive models, Proc. Symp. on Sensing, Modeling and Simulation in Emerging Electronic Packaging Interconnects, ASME WAM, Atlantic, GA, 1996.
-
(1996)
Proc. Symp. on Sensing, Modeling and Simulation in Emerging Electronic Packaging Interconnects
-
-
Fu, C.1
Ume, I.C.2
McDowell, D.L.3
-
11
-
-
0029708531
-
Time integration procedures for a cyclic thermoviscoplasticity model for Pb-Sn solder applications
-
Orlando, FL
-
C. Fu, D.L. McDowell, I.C. Ume, Time integration procedures for a cyclic thermoviscoplasticity model for Pb-Sn solder applications, Proc. IEEE 46th Electronic Components & Tech. Conf. (ECTC), Orlando, FL, 1996.
-
(1996)
Proc. IEEE 46th Electronic Components & Tech. Conf. (ECTC)
-
-
Fu, C.1
McDowell, D.L.2
Ume, I.C.3
-
12
-
-
0347222524
-
A finite element analysis procedure with a cyclic thermoviscoplasticity model for Pb-Sn solder and copper interconnects
-
to appear
-
C. Fu, D.L. McDowell, I.C. Ume, A finite element analysis procedure with a cyclic thermoviscoplasticity model for Pb-Sn solder and copper interconnects, ASME J. Electronic Packaging to appear.
-
ASME J. Electronic Packaging
-
-
Fu, C.1
McDowell, D.L.2
Ume, I.C.3
-
13
-
-
0345961268
-
Thermoplastic finite element analysis of plated-through holes during simulated wave soldering processes
-
submitted
-
C. Fu, D.L. McDowell, I.C. Ume, Thermoplastic finite element analysis of plated-through holes during simulated wave soldering processes, ASME J. Electronic Packaging, submitted.
-
ASME J. Electronic Packaging
-
-
Fu, C.1
McDowell, D.L.2
Ume, I.C.3
-
14
-
-
0031139379
-
A semi-implicit integration scheme for rate-dependent and rate-independent plasticity
-
E.B. Marin, D.L. McDowell, A semi-implicit integration scheme for rate-dependent and rate-independent plasticity, Comput. Struct. 63 (3) (1997) 579-600.
-
(1997)
Comput. Struct.
, vol.63
, Issue.3
, pp. 579-600
-
-
Marin, E.B.1
McDowell, D.L.2
-
15
-
-
0027079570
-
A three dimensional numerical investigation of fracture initiation by ductile failure mechanisms in a 4340 Steel
-
ASMEAMD
-
R. Narasimhann, A.J. Rosakis, B. Moran, A three dimensional numerical investigation of fracture initiation by ductile failure mechanisms in a 4340 Steel, Adv. Fracture/Damage Models Anal. Eng. Problems ASMEAMD 137 (1988) 13-53.
-
(1988)
Adv. Fracture/Damage Models Anal. Eng. Problems
, vol.137
, pp. 13-53
-
-
Narasimhann, R.1
Rosakis, A.J.2
Moran, B.3
-
16
-
-
0041076243
-
-
Master Thesis, School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA
-
J.F. Sizemore, A study of the thermo-mechanical behavior of a plated-through hole under solder shock testing, Master Thesis, School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, 1996.
-
(1996)
A Study of the Thermo-mechanical Behavior of a Plated-through Hole under Solder Shock Testing
-
-
Sizemore, J.F.1
-
17
-
-
0023854625
-
A critical plane approach to multiaxial fatigue damage including out-of-phase loading
-
A. Fatemi, D.F. Socie, A critical plane approach to multiaxial fatigue damage including out-of-phase loading, Fatigue Fracture Eng. Mater. Struct. 11 (3) (1988) 149-165.
-
(1988)
Fatigue Fracture Eng. Mater. Struct.
, vol.11
, Issue.3
, pp. 149-165
-
-
Fatemi, A.1
Socie, D.F.2
-
18
-
-
0026726981
-
A multiaxial fatigue life estimation technique
-
M. R. Mitchell, R.W. Landgraf (Eds.), ASTM STP 1122, American Society for Testing and Materials
-
J.A. Bannantine, D.F. Socie, A multiaxial fatigue life estimation technique, in: M. R. Mitchell, R.W. Landgraf (Eds.), Advances in Fatigue Lifetime Predictive Techniques, ASTM STP 1122, American Society for Testing and Materials, 1992, pp. 249-275.
-
(1992)
Advances in Fatigue Lifetime Predictive Techniques
, pp. 249-275
-
-
Bannantine, J.A.1
Socie, D.F.2
|