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Volumn 30, Issue 1-2, 1998, Pages 1-17

Thermal stress and fatigue analysis of plated-through holes using an internal state variable constitutive model

Author keywords

Critical plane fatigue theory; Internal state variable; Multiaxial fatigue life prediction; Plated through hole; Printed wiring board

Indexed keywords

COMPUTER SIMULATION; COPPER; FATIGUE OF MATERIALS; MATHEMATICAL MODELS; STRESS ANALYSIS; THERMAL STRESS;

EID: 0032118775     PISSN: 0168874X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0168-874X(98)00029-8     Document Type: Article
Times cited : (19)

References (19)
  • 1
    • 0347852626 scopus 로고    scopus 로고
    • ABAQUS Hibbit, Karisson & Sorenson, Pawtucket, RI, Version 5.5, 1996
    • ABAQUS Hibbit, Karisson & Sorenson, Pawtucket, RI, Version 5.5, 1996.
  • 2
    • 0021530991 scopus 로고
    • Micromechanics of multilayer printed circuit boards
    • L.C. Lee, V.V. Darekar, C.K. Lim, Micromechanics of multilayer printed circuit boards, IBM J. Res. Dev. 28 (1984) 715-732.
    • (1984) IBM J. Res. Dev. , vol.28 , pp. 715-732
    • Lee, L.C.1    Darekar, V.V.2    Lim, C.K.3
  • 3
    • 0022880549 scopus 로고
    • Analysis of long term reliability of plated-through holes in multilayer interconnection boards, Part A: Stress analysis and material characterization
    • K.S. Vecchio, R.W. Hertzberg, Analysis of long term reliability of plated-through holes in multilayer interconnection boards, Part A: stress analysis and material characterization, Microelectronic Reliability 26 (4) (1986) 715-732.
    • (1986) Microelectronic Reliability , vol.26 , Issue.4 , pp. 715-732
    • Vecchio, K.S.1    Hertzberg, R.W.2
  • 5
    • 0026839534 scopus 로고
    • Influence of selected design variables on the thermo-mechanical stress distributions in plated-through-hole structures
    • S.M. Bhandarkar, A. Dasgupta, D.B. Barker, M. Pecht, W. Engelmaier, Influence of selected design variables on the thermo-mechanical stress distributions in plated-through-hole structures, J. Electronic Packaging 114 (1) (1992) 8-13.
    • (1992) J. Electronic Packaging , vol.114 , Issue.1 , pp. 8-13
    • Bhandarkar, S.M.1    Dasgupta, A.2    Barker, D.B.3    Pecht, M.4    Engelmaier, W.5
  • 6
    • 0026170928 scopus 로고
    • Transient thermal stress analysis of a plated through hole subjected to wave soldering
    • D. Barkar, M. Pecht, A. Dasgupta, S. Naqvi, Transient thermal stress analysis of a plated through hole subjected to wave soldering, J. of Electronic Packaging 113 (2) (1991) 149-155.
    • (1991) J. of Electronic Packaging , vol.113 , Issue.2 , pp. 149-155
    • Barkar, D.1    Pecht, M.2    Dasgupta, A.3    Naqvi, S.4
  • 7
    • 0039297170 scopus 로고
    • Effect of processing induced defects on reliability of plated through holes in PWB
    • S. Liu, Y.H. Mei, S.G. Zhou, J.S. Zhu, Effect of processing induced defects on reliability of plated through holes in PWB, Proc. ISHM, 1994.
    • (1994) Proc. ISHM
    • Liu, S.1    Mei, Y.H.2    Zhou, S.G.3    Zhu, J.S.4
  • 8
    • 0027277274 scopus 로고
    • Critical plane approaches for multiaxial fatigue damage assessment
    • D.L. McDowell, R. Ellis (Eds.), ASTM STP 1191, American Society for Testing and Materials
    • D.F. Socie, Critical plane approaches for multiaxial fatigue damage assessment, in: D.L. McDowell, R. Ellis (Eds.), Advances in Multiaxial Fatigue, ASTM STP 1191, American Society for Testing and Materials, 1993, pp. 7-36.
    • (1993) Advances in Multiaxial Fatigue , pp. 7-36
    • Socie, D.F.1
  • 9
    • 0027066363 scopus 로고
    • A nonlinear kinematic hardening theory for cyclic thermoplasticity and thermoviscoplasticity
    • D.L. McDowell, A nonlinear kinematic hardening theory for cyclic thermoplasticity and thermoviscoplasticity, Int. J. Plasticity 8 (1992) 695-728.
    • (1992) Int. J. Plasticity , vol.8 , pp. 695-728
    • McDowell, D.L.1
  • 12
    • 0347222524 scopus 로고    scopus 로고
    • A finite element analysis procedure with a cyclic thermoviscoplasticity model for Pb-Sn solder and copper interconnects
    • to appear
    • C. Fu, D.L. McDowell, I.C. Ume, A finite element analysis procedure with a cyclic thermoviscoplasticity model for Pb-Sn solder and copper interconnects, ASME J. Electronic Packaging to appear.
    • ASME J. Electronic Packaging
    • Fu, C.1    McDowell, D.L.2    Ume, I.C.3
  • 13
    • 0345961268 scopus 로고    scopus 로고
    • Thermoplastic finite element analysis of plated-through holes during simulated wave soldering processes
    • submitted
    • C. Fu, D.L. McDowell, I.C. Ume, Thermoplastic finite element analysis of plated-through holes during simulated wave soldering processes, ASME J. Electronic Packaging, submitted.
    • ASME J. Electronic Packaging
    • Fu, C.1    McDowell, D.L.2    Ume, I.C.3
  • 14
    • 0031139379 scopus 로고    scopus 로고
    • A semi-implicit integration scheme for rate-dependent and rate-independent plasticity
    • E.B. Marin, D.L. McDowell, A semi-implicit integration scheme for rate-dependent and rate-independent plasticity, Comput. Struct. 63 (3) (1997) 579-600.
    • (1997) Comput. Struct. , vol.63 , Issue.3 , pp. 579-600
    • Marin, E.B.1    McDowell, D.L.2
  • 15
    • 0027079570 scopus 로고
    • A three dimensional numerical investigation of fracture initiation by ductile failure mechanisms in a 4340 Steel
    • ASMEAMD
    • R. Narasimhann, A.J. Rosakis, B. Moran, A three dimensional numerical investigation of fracture initiation by ductile failure mechanisms in a 4340 Steel, Adv. Fracture/Damage Models Anal. Eng. Problems ASMEAMD 137 (1988) 13-53.
    • (1988) Adv. Fracture/Damage Models Anal. Eng. Problems , vol.137 , pp. 13-53
    • Narasimhann, R.1    Rosakis, A.J.2    Moran, B.3
  • 17
    • 0023854625 scopus 로고
    • A critical plane approach to multiaxial fatigue damage including out-of-phase loading
    • A. Fatemi, D.F. Socie, A critical plane approach to multiaxial fatigue damage including out-of-phase loading, Fatigue Fracture Eng. Mater. Struct. 11 (3) (1988) 149-165.
    • (1988) Fatigue Fracture Eng. Mater. Struct. , vol.11 , Issue.3 , pp. 149-165
    • Fatemi, A.1    Socie, D.F.2
  • 18
    • 0026726981 scopus 로고
    • A multiaxial fatigue life estimation technique
    • M. R. Mitchell, R.W. Landgraf (Eds.), ASTM STP 1122, American Society for Testing and Materials
    • J.A. Bannantine, D.F. Socie, A multiaxial fatigue life estimation technique, in: M. R. Mitchell, R.W. Landgraf (Eds.), Advances in Fatigue Lifetime Predictive Techniques, ASTM STP 1122, American Society for Testing and Materials, 1992, pp. 249-275.
    • (1992) Advances in Fatigue Lifetime Predictive Techniques , pp. 249-275
    • Bannantine, J.A.1    Socie, D.F.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.