-
1
-
-
0023312081
-
Measurement and interpretation of stress in aluminum-based metallization as a function of thermal history
-
FLINN P.A., GARDNER D.S., NIX W.D., Measurement and interpretation of stress in aluminum-based metallization as a function of thermal history, IEEE Transactions on Electron Devices 34(3), 1987, pp. 689-699.
-
(1987)
IEEE Transactions on Electron Devices
, vol.34
, Issue.3
, pp. 689-699
-
-
Flinn, P.A.1
Gardner, D.S.2
Nix, W.D.3
-
2
-
-
0024123113
-
Mechanical stress as a function of temperature in aluminum films
-
GARDNER D.S., FLINN P.A., Mechanical stress as a function of temperature in aluminum films, IEEE Transactions on Electron Devices 35(12), 1988, pp. 2160-2169.
-
(1988)
IEEE Transactions on Electron Devices
, vol.35
, Issue.12
, pp. 2160-2169
-
-
Gardner, D.S.1
Flinn, P.A.2
-
3
-
-
0031118184
-
Model for predicting thermal stresses in thin polycrystalline films
-
JIUN-SHYA YU, MANIATTY A.M., KNORR D.B., Model for predicting thermal stresses in thin polycrystalline films, Journal of the Mechanics and Physics of Solids 45(4), 1997, pp. 511-534.
-
(1997)
Journal of the Mechanics and Physics of Solids
, vol.45
, Issue.4
, pp. 511-534
-
-
Jiun-Shya, Y.U.1
Maniatty, A.M.2
Knorr, D.B.3
-
4
-
-
0344961045
-
-
PhD Thesis, Faculté des Sciences et Techniques de Saint-Jérôme, Marseille, France
-
BOSTROM O., Wafer shape control study of the reactivity in Ti/Al dual layers and its effect on the stress, PhD Thesis, Faculté des Sciences et Techniques de Saint-Jérôme, Marseille, France, 2001.
-
(2001)
Wafer Shape Control Study of the Reactivity in Ti/Al Dual Layers and Its Effect on the Stress
-
-
Bostrom, O.1
-
6
-
-
0032714755
-
Stress-temperature behavior of unpassivated thin copper films
-
KELLER R.-M., BAKER S.P., ARZT E., Stress-temperature behavior of unpassivated thin copper films, Acta Materialia 47(2), 1999, pp. 415-426.
-
(1999)
Acta Materialia
, vol.47
, Issue.2
, pp. 415-426
-
-
Keller, R.-M.1
Baker, S.P.2
Arzt, E.3
-
7
-
-
0035426516
-
Constrained diffusional creep in UHV-produced copper thin films
-
DOI 10.1016/S1359-6454(01)00168-9, PII S1359645401001689
-
WEISS D., GAO H., ARZT E., Constrained diffusional creep in UHV-produced copper thin films, Acta Materialia 49(13), 2001, pp. 2395-2403. (Pubitemid 32621515)
-
(2001)
Acta Materialia
, vol.49
, Issue.13
, pp. 2395-2403
-
-
Weiss, D.1
Gao, H.2
Arzt, E.3
-
8
-
-
0029325729
-
Thermal strain and stress in copper thin films
-
VINCI R.P., ZIELINSKI E.M., BRAVMAN J.C., Thermal strain and stress in copper thin films, Thin Solid Films 262(1-2), 1995, pp. 142-153.
-
(1995)
Thin Solid Films
, vol.262
, Issue.1-2
, pp. 142-153
-
-
Vinci, R.P.1
Zielinski, E.M.2
Bravman, J.C.3
-
10
-
-
0000073841
-
The tension of metallic films deposited by electrolysis
-
STONEY G.G., The tension of metallic films deposited by electrolysis, Proceedings of the Royal Society A 82(553), 1909, pp. 172-175.
-
(1909)
Proceedings of the Royal Society A
, vol.82
, Issue.553
, pp. 172-175
-
-
Stoney, G.G.1
-
11
-
-
0035340248
-
The dynamic competition between stress generation and relaxation mechanisms during coalescence of Volmer-Weber thin films
-
DOI 10.1063/1.1352563
-
FLORO J.A., HEARNE S.J., HUNTER J.A., KOTULA P., CHASON E., SEEL S.C., THOMPSON C.V., The dynamic competition between stress generation and relaxation mechanisms during coalescence of Volmer-Weber thin films, Journal of Applied Physics 89(9), 2001, pp. 4886-4897. (Pubitemid 33664414)
-
(2001)
Journal of Applied Physics
, vol.89
, Issue.9
, pp. 4886-4897
-
-
Floro, J.A.1
Hearne, S.J.2
Hunter, J.A.3
Kotula, P.4
Chason, E.5
Seel, S.C.6
Thompson, C.V.7
-
12
-
-
0036148119
-
Physical origins of intrinsic stresses in Volmer-Weber thin films
-
FLORO J.A., CHASON E., CAMMARATA R.C., SROLOVITZ D.J., Physical origins of intrinsic stresses in Volmer-Weber thin films, MRS Bulletin 27(1), 2002, pp. 19-25.
-
(2002)
MRS Bulletin
, vol.27
, Issue.1
, pp. 19-25
-
-
Floro, J.A.1
Chason, E.2
Cammarata, R.C.3
Srolovitz, D.J.4
-
13
-
-
52149089008
-
Diffusional creep induced stress relaxation in thin Cu films on silicon
-
CHOCYK D., PROSZYNSKI A., GLADYSZEWSKI G., Diffusional creep induced stress relaxation in thin Cu films on silicon, Microelectronic Engineering 85(10), 2008, pp. 2179-2182.
-
(2008)
Microelectronic Engineering
, vol.85
, Issue.10
, pp. 2179-2182
-
-
Chocyk, D.1
Proszynski, A.2
Gladyszewski, G.3
|