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Volumn 39, Issue 4, 2009, Pages 705-710

Stress modification in gold metal thin films during thermal annealing

Author keywords

Annealing; Strain; Stress; Thin films

Indexed keywords

AU THIN FILMS; FIRST CYCLE; METAL FILM; METAL THIN FILM; STRESS EVOLUTION; STRUCTURAL CHANGE; STRUCTURAL MODIFICATIONS; SUBSTRATE CURVATURE; THERMAL VACUUM; THERMAL-ANNEALING; X-RAY DIFFRACTION MEASUREMENTS;

EID: 77449115776     PISSN: 00785466     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (14)

References (13)
  • 1
    • 0023312081 scopus 로고
    • Measurement and interpretation of stress in aluminum-based metallization as a function of thermal history
    • FLINN P.A., GARDNER D.S., NIX W.D., Measurement and interpretation of stress in aluminum-based metallization as a function of thermal history, IEEE Transactions on Electron Devices 34(3), 1987, pp. 689-699.
    • (1987) IEEE Transactions on Electron Devices , vol.34 , Issue.3 , pp. 689-699
    • Flinn, P.A.1    Gardner, D.S.2    Nix, W.D.3
  • 2
    • 0024123113 scopus 로고
    • Mechanical stress as a function of temperature in aluminum films
    • GARDNER D.S., FLINN P.A., Mechanical stress as a function of temperature in aluminum films, IEEE Transactions on Electron Devices 35(12), 1988, pp. 2160-2169.
    • (1988) IEEE Transactions on Electron Devices , vol.35 , Issue.12 , pp. 2160-2169
    • Gardner, D.S.1    Flinn, P.A.2
  • 6
    • 0032714755 scopus 로고    scopus 로고
    • Stress-temperature behavior of unpassivated thin copper films
    • KELLER R.-M., BAKER S.P., ARZT E., Stress-temperature behavior of unpassivated thin copper films, Acta Materialia 47(2), 1999, pp. 415-426.
    • (1999) Acta Materialia , vol.47 , Issue.2 , pp. 415-426
    • Keller, R.-M.1    Baker, S.P.2    Arzt, E.3
  • 7
    • 0035426516 scopus 로고    scopus 로고
    • Constrained diffusional creep in UHV-produced copper thin films
    • DOI 10.1016/S1359-6454(01)00168-9, PII S1359645401001689
    • WEISS D., GAO H., ARZT E., Constrained diffusional creep in UHV-produced copper thin films, Acta Materialia 49(13), 2001, pp. 2395-2403. (Pubitemid 32621515)
    • (2001) Acta Materialia , vol.49 , Issue.13 , pp. 2395-2403
    • Weiss, D.1    Gao, H.2    Arzt, E.3
  • 8
    • 0029325729 scopus 로고
    • Thermal strain and stress in copper thin films
    • VINCI R.P., ZIELINSKI E.M., BRAVMAN J.C., Thermal strain and stress in copper thin films, Thin Solid Films 262(1-2), 1995, pp. 142-153.
    • (1995) Thin Solid Films , vol.262 , Issue.1-2 , pp. 142-153
    • Vinci, R.P.1    Zielinski, E.M.2    Bravman, J.C.3
  • 10
    • 0000073841 scopus 로고
    • The tension of metallic films deposited by electrolysis
    • STONEY G.G., The tension of metallic films deposited by electrolysis, Proceedings of the Royal Society A 82(553), 1909, pp. 172-175.
    • (1909) Proceedings of the Royal Society A , vol.82 , Issue.553 , pp. 172-175
    • Stoney, G.G.1
  • 11
    • 0035340248 scopus 로고    scopus 로고
    • The dynamic competition between stress generation and relaxation mechanisms during coalescence of Volmer-Weber thin films
    • DOI 10.1063/1.1352563
    • FLORO J.A., HEARNE S.J., HUNTER J.A., KOTULA P., CHASON E., SEEL S.C., THOMPSON C.V., The dynamic competition between stress generation and relaxation mechanisms during coalescence of Volmer-Weber thin films, Journal of Applied Physics 89(9), 2001, pp. 4886-4897. (Pubitemid 33664414)
    • (2001) Journal of Applied Physics , vol.89 , Issue.9 , pp. 4886-4897
    • Floro, J.A.1    Hearne, S.J.2    Hunter, J.A.3    Kotula, P.4    Chason, E.5    Seel, S.C.6    Thompson, C.V.7
  • 12
    • 0036148119 scopus 로고    scopus 로고
    • Physical origins of intrinsic stresses in Volmer-Weber thin films
    • FLORO J.A., CHASON E., CAMMARATA R.C., SROLOVITZ D.J., Physical origins of intrinsic stresses in Volmer-Weber thin films, MRS Bulletin 27(1), 2002, pp. 19-25.
    • (2002) MRS Bulletin , vol.27 , Issue.1 , pp. 19-25
    • Floro, J.A.1    Chason, E.2    Cammarata, R.C.3    Srolovitz, D.J.4
  • 13
    • 52149089008 scopus 로고    scopus 로고
    • Diffusional creep induced stress relaxation in thin Cu films on silicon
    • CHOCYK D., PROSZYNSKI A., GLADYSZEWSKI G., Diffusional creep induced stress relaxation in thin Cu films on silicon, Microelectronic Engineering 85(10), 2008, pp. 2179-2182.
    • (2008) Microelectronic Engineering , vol.85 , Issue.10 , pp. 2179-2182
    • Chocyk, D.1    Proszynski, A.2    Gladyszewski, G.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.