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Volumn 85, Issue 10, 2008, Pages 2179-2182
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Diffusional creep induced stress relaxation in thin Cu films on silicon
a
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Author keywords
Annealing; Copper; Creep; Curvature measurements; Thin films
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Indexed keywords
ANNEALING;
COPPER;
COPPER PLATING;
CREEP;
EPITAXIAL GROWTH;
HEATING;
METALLIC FILMS;
NONMETALS;
OPTICAL SYSTEMS;
SILICON;
THICK FILMS;
THIN FILMS;
VAPOR DEPOSITION;
ANNEALING EXPERIMENTS;
COBLE CREEP;
CU FILMS;
CURVATURE MEASUREMENTS;
DIFFUSIONAL CREEP;
EXPERIMENTAL DATA;
FILM-THICKNESS;
INDUCED STRESSES;
INITIAL VALUES;
OPTICAL-;
ROOM TEMPERATURES;
SI SUBSTRATES;
TEMPERATURE STRESSING;
TEMPERATURE VALUES;
THIN COPPER FILMS;
MOLECULAR BEAM EPITAXY;
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EID: 52149089008
PISSN: 01679317
EISSN: None
Source Type: Journal
DOI: 10.1016/j.mee.2008.05.037 Document Type: Article |
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Times cited : (14)
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References (14)
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