Model for predicting thermal stresses in thin polycrystalline films

Journal of the Mechanics and Physics of Solids

Volumn 45, Issue 4, 1997, Pages 511-534

  Yu, Jiun Shya ^a   Maniatty, Antoinette M ^a   Knorr, David B ^b  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^b Knolls Atomic Power Laboratory   (United States)

Author keywords

A. Strengthening mechanisms; A. Stress relaxation; A. Thin films; B. Polycrystalline material; B. Thermal stress

Indexed keywords

CRYSTAL MICROSTRUCTURE; CRYSTAL ORIENTATION; DISLOCATIONS (CRYSTALS); GRAIN BOUNDARIES; MATHEMATICAL MODELS; PLASTIC DEFORMATION; POLYCRYSTALLINE MATERIALS; STRENGTHENING (METAL); STRESS CONCENTRATION; STRESS RELAXATION; THERMAL STRESS; VISCOPLASTICITY;

CRYSTALLOGRAPHIC SLIP;

THIN FILMS;

EID: 0031118184     PISSN: 00225096     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0022-5096(96)00104-4     Document Type: Article

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