Micron-scale channel formation by the release and bond-back of pre-stressed thin films: A finite element analysis

Journal of the Mechanics and Physics of Solids

Volumn 58, Issue 4, 2010, Pages 447-465

  Annabattula, R K ^a   Huck, W T S ^b   Onck, P R ^a  

^a UNIVERSITY OF GRONINGEN   (Netherlands)

^b UNIVERSITY OF CAMBRIDGE   (United Kingdom)

Author keywords

Buckle driven delamination; Finite element analysis; Micro nano fluidic channels; Release and bond back; Thin films

Indexed keywords

BUCKLE-DRIVEN DELAMINATION; CHANNEL FORMATION; CHANNEL GEOMETRY; COHESIVE INTERFACE; DIMENSIONLESS PARAMETERS; EIGEN-STRAIN; FILM DIMENSIONS; FINITE ELEMENT ANALYSIS; FLUIDIC CHANNELS; INTERFACE TOUGHNESS; MICRO/NANO-FLUIDIC CHANNELS; MICRON SCALE; NANO SCALE; NUMERICAL MODELS; OPTICAL GRATING; PATTERNED SURFACE; PRE-STRESSED; RIGID SUBSTRATES; STRAINED THIN FILMS; TECHNOLOGICAL APPLICATIONS;

BUCKLING; FLUIDIC DEVICES; STEEL SHEET; THIN FILMS;

FINITE ELEMENT METHOD;

EID: 77349085502     PISSN: 00225096     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmps.2010.02.004     Document Type: Article

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