-
1
-
-
20144389171
-
-
R.R. Tummala, P.M. Raj, S. Atmur, S. Banerji, F. Liu, S. Bhattachatya, V. Sundaram, K.I. Shinotani and G White, J. Electrogram., 13 (2004) 417-422.
-
(2004)
J. Electrogram.
, vol.13
, pp. 417-422
-
-
Tummala, R.R.1
Raj, P.M.2
Atmur, S.3
Banerji, S.4
Liu, F.5
Bhattachatya, S.6
Sundaram, V.7
Shinotani, K.I.8
White, G.9
-
2
-
-
4544346240
-
-
R.R. Tummala, M. Swaminathan, M.M. Tentzeris, J. Laskar, G.K. Chang, S. Sitaraman, D. Keezer, Da. Guidotti, Z. Huang, K. Lim, L. Wan, S.K. Bhattacharya, V. Sundaram, F. Liu and P. Raj. Markondeya, IEEE Trans. Adv. Packag., 27 (2004) 250-267.
-
(2004)
IEEE Trans. Adv. Packag.
, vol.27
, pp. 250-267
-
-
Tummala, R.R.1
Swaminathan, M.2
Tentzeris, M.M.3
Laskar, J.4
Chang, G.K.5
Sitaraman, S.6
Keezer, D.7
Guidotti, D.A.8
Huang, Z.9
Lim, K.10
Wan, L.11
Bhattacharya, S.K.12
Sundaram, V.13
Liu, F.14
Raj Markondeya, P.15
-
4
-
-
0036404811
-
-
Y. Rao, J. Yue and C.P. Wong, Active and Passive Elec. Comp., 2002, 25 (2002) 123-129.
-
(2002)
Active and Passive Elec. Comp.
, vol.25
, Issue.2002
, pp. 123-129
-
-
Rao, Y.1
Yue, J.2
Wong, C.P.3
-
5
-
-
0037942568
-
-
H. Windlass, P.M. Raj, D. Balaraman, S.K. Bhattacharya and R.R. Tummala, IEEE Trans. Adv. Packag., 26[2] (2003).
-
(2003)
IEEE Trans. Adv. Packag.
, vol.26
, pp. 2
-
-
Windlass, H.1
Raj, P.M.2
Balaraman, D.3
Bhattacharya, S.K.4
Tummala, R.R.5
-
6
-
-
0035452796
-
-
D.H. Kuo, C.C. Chang, T.Y. Su, W.K. Wang and B.Y. Lin, J. Eur. Ceram. Soc., 21 (2001) 1171-1177.
-
(2001)
J. Eur. Ceram. Soc.
, vol.21
, pp. 1171-1177
-
-
Kuo, D.H.1
Chang, C.C.2
Su, T.Y.3
Wang, W.K.4
Lin, B.Y.5
-
7
-
-
0035860055
-
-
R. Popielarz, C.K. Chiang, R. Nozaki and J. Obrzut, Macromolecules, 34 (2001) 5910-5915.
-
(2001)
Macromolecules
, vol.34
, pp. 5910-5915
-
-
Popielarz, R.1
Chiang, C.K.2
Nozaki, R.3
Obrzut, J.4
-
9
-
-
0037203632
-
-
Y. Rao, S. Ogitani, P. Kohl and C.P. Wong, J. Appl. Polym. Sci., 83 (2001) 1084-1090.
-
(2001)
J. Appl. Polym. Sci.
, vol.83
, pp. 1084-1090
-
-
Rao, Y.1
Ogitani, S.2
Kohl, P.3
Wong, C.P.4
-
10
-
-
36248983703
-
-
R. Kota, A.F. Ali, B.I. Lee and M.M. Sychov, Microelectron. Eng., 84 (2007) 2853-2858.
-
(2007)
Microelectron. Eng.
, vol.84
, pp. 2853-2858
-
-
Kota, R.1
Ali, A.F.2
Lee, B.I.3
Sychov, M.M.4
-
13
-
-
6344243340
-
-
S.M. Nam, N. Mori, H. Kakemoto, S. Wada, J. Akedo and T. Tsurumi, Jpn. J. Appl. Phys., 43 (2004) 5414-5418.
-
(2004)
Jpn. J. Appl. Phys.
, vol.43
, pp. 5414-5418
-
-
Nam, S.M.1
Mori, N.2
Kakemoto, H.3
Wada, S.4
Akedo, J.5
Tsurumi, T.6
-
14
-
-
67349144389
-
-
H.J. Kim, Y.J. Yoon, J.H. Kim and S.M. Nam, Mat. Sci. Eng. B, 161 [1-3] (2009) 104-108.
-
(2009)
Mat. Sci. Eng. B
, vol.161
, Issue.1-3
, pp. 104-108
-
-
Kim, H.J.1
Yoon, Y.J.2
Kim, J.H.3
Nam, S.M.4
-
15
-
-
53849116457
-
-
J.C. Park, Y.J. Yoon, H.T. Kim, E.H. Koo, S.M. Nam, J.H. Kim and K.B. Shim, J. Kor. Ceram. Soc, 45 (2008) 411-417.
-
(2008)
J. Kor. Ceram. Soc
, vol.45
, pp. 411-417
-
-
Park, J.C.1
Yoon, Y.J.2
Kim, H.T.3
Koo, E.H.4
Nam, S.M.5
Kim, J.H.6
Shim, K.B.7
|