Fundamental limits of organic packages and boards and the need for novel ceramic boards for next generation electronic packaging

Journal of Electroceramics

Volumn 13, Issue 1-3, 2004, Pages 417-422

  Tummala, Rao R ^a   Raj, P Markondeya ^a   Atmur, Steve ^b   Bansal, Shubhra ^a   Banerji, Sounak ^a   Liu, Fuhan ^a   Bhattacharya, Swapan ^a   Sundaram, Venky ^a   Shinotani, Ken Ichi ^c   White, George ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b Starfire Systems Inc   (United States)

^c PANASONIC CORPORATION   (Japan)

Author keywords

Electronic packaging; Flip chip; FR4; High density packaging; High density wiring; Printed Wiring Board; Reliability; SiC; System On Package

Indexed keywords

CERAMIC MATERIALS; DIELECTRIC MATERIALS; FUNCTIONS; LITHOGRAPHY; OPTOELECTRONIC DEVICES; RELIABILITY; SILICON COMPOUNDS; WAVEGUIDES;

FLIP CHIP; FR4; HIGH DENSITY PACKAGING; HIGH DENSITY WIRING; PRINTED WIRING BOARD; SIC; SYSTEM-ON-PACKAGE;

ELECTRONICS PACKAGING;

EID: 20144389171     PISSN: 13853449     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10832-004-5135-6     Document Type: Conference Paper

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