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Volumn 12, Issue 3, 2010, Pages 431-434
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Evolution of surface width in electrochemical nucleation and growth
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Author keywords
Copper deposition; Dynamic scaling; Electrodeposition; Kinetic roughening; Nucleation and growth
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Indexed keywords
COPPER DEPOSITION;
ELECTROCHEMICAL NUCLEATION;
ELECTRODEPOSITION KINETICS;
FILM ROUGHNESS;
ISLAND DENSITY;
ISLAND GROWTH;
ISLAND SHAPE;
KINETIC REGIME;
NUCLEATION AND GROWTH;
COALESCENCE;
COPPER;
COPPER PLATING;
ELECTRODEPOSITION;
GROWTH KINETICS;
NUCLEATION;
SURFACE ROUGHNESS;
FILM GROWTH;
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EID: 76449091822
PISSN: 13882481
EISSN: None
Source Type: Journal
DOI: 10.1016/j.elecom.2010.01.011 Document Type: Article |
Times cited : (7)
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References (16)
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