Pattern recognition and scaling studies of copper electrodeposition on Cu(100) in the presence of additives

Journal of the Electrochemical Society

Volumn 150, Issue 8, 2003, Pages

  Wu, A ^a   Barkey, D P ^a  

^a University of New Hampshire   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; ATOMIC FORCE MICROSCOPY; CHLORINE; ELECTRODEPOSITION; PATTERN RECOGNITION; PLATING; SULFUR COMPOUNDS; SULFURIC ACID; SURFACES;

ACID SULFATE PLATING; BENZOTRIAZOLE; CHLORIDE; MERCAPTOPROPANE SULFONIC ACID;

COPPER;

EID: 0042709460     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1590993     Document Type: Article

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