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Journal of the Electrochemical Society

Volumn 157, Issue 3, 2010, Pages

Ultrathin diffusion barrier for copper metallization: A thermally stable amorphous rare-earth scandate

(6) Chu, J P a Yu, T Y a Wu, C H a Lin, C H b Wang, S F c Chen, Q d

a NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY (Taiwan)

b CHIN MIN INSTITUTE OF TECHNOLOGY (Taiwan)

c NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY (Taiwan)

d HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY (China)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHOUS BARRIERS; COPPER METALLIZATION; CU DIFFUSION BARRIER; EFFECTIVE DIFFUSION; ELECTRICAL RESISTIVITY; HIGH TEMPERATURE; SCANDATES; THERMALLY STABLE; ULTRA-THIN; HIGHLY STABLES;

ANNEALING; COPPER CORROSION; DIFFUSION BARRIERS; ELECTRIC CONDUCTIVITY; METALLIZING; RARE EARTH ELEMENTS; TRANSMISSION ELECTRON MICROSCOPY; AUGER ELECTRON SPECTROSCOPY; COPPER; DIFFUSION; ELECTRON SPECTROSCOPY;

AUGER ELECTRON SPECTROSCOPY; DIFFUSION BARRIERS;

EID: 76349098722 PISSN: 00134651 EISSN: None Source Type: Journal
DOI: 10.1149/1.3298470 Document Type: Article

Times cited : (8)

References (9)

1
- 0042266842
- CMATEX 0897-4756, 10.1021/cm021772s
- J. S. Becker, S. Suh, S. Wang, and R. G. Gordon, Chem. Mater. CMATEX 0897-4756, 15, 2969 (2003). 10.1021/cm021772s
- (2003) Chem. Mater. , vol.15 , pp. 2969
- Becker, J.S.¹ Suh, S.² Wang, S.³ Gordon, R.G.⁴

2
- 35248846921
- 5-nm-thick TaSiC amorphous films stable up to 750 °c as a diffusion barrier for copper metallization
- DOI 10.1063/1.2799245
- T. -Y. LH. -Y. Cheng, T. -S. ChC. -F. Chiu, and J. -S. Fang, Appl. Phys. Lett. APPLAB 0003-6951, 91, 152908 (2007). 10.1063/1.2799245 (Pubitemid 47568961)
- (2007) Applied Physics Letters , vol.91 , Issue.15 , pp. 152908
- Lin, T.-Y.¹ Cheng, H.-Y.² Chin, T.-S.³ Chiu, C.-F.⁴ Fang, J.-S.⁵

3
- 48249136212
- APPLAB 0003-6951, 10.1063/1.2963984
- K. Neishi, S. Aki, K. Matsumoto, H. Sato, H. Itoh, S. Hosaka, and J. Koike, Appl. Phys. Lett. APPLAB 0003-6951, 93, 032106 (2008). 10.1063/1.2963984
- (2008) Appl. Phys. Lett. , vol.93 , pp. 032106
- Neishi, K.¹ Aki, S.² Matsumoto, K.³ Sato, H.⁴ Itoh, H.⁵ Hosaka, S.⁶ Koike, J.⁷

4
- 33750836706
- Effect of tin-doped indium oxide film thickness on the diffusion barrier between silicon and copper
- DOI 10.1016/j.tsf.2006.04.042, PII S0040609006006092
- W. L. Liu, W. J. Chen, T. K. Tsai, S. H. Hsieh, and C. M. Liu, Thin Solid Films THSFAP 0040-6090, 515, 2387 (2006). 10.1016/j.tsf.2006.04.042 (Pubitemid 44716065)
- (2006) Thin Solid Films , vol.515 , Issue.4 , pp. 2387-2392
- Liu, W.L.¹ Chen, W.J.² Tsai, T.K.³ Hsieh, S.H.⁴ Liu, C.M.⁵

5
- 35548976201
- 3 diffusion barriers in copper metallization
- DOI 10.1016/j.jcrysgro.2007.09.013, PII S0022024807007816
- P. Majumder, R. Katamreddy, and C. Takoudis, J. Cryst. Growth JCRGAE 0022-0248, 309, 12 (2007). 10.1016/j.jcrysgro.2007.09.013 (Pubitemid 350016005)
- (2007) Journal of Crystal Growth , vol.309 , Issue.1 , pp. 12-17
- Majumder, P.¹ Katamreddy, R.² Takoudis, C.³

6
- 33845384913
- Dysprosium scandate thin films as an alternate amorphous gate oxide prepared by metal-organic chemical vapor deposition
- DOI 10.1063/1.2402121
- R. Thomas, P. Ehrhart, M. Luysberg, M. Boese, R. Waser, M. Roeckerath, E. Rije, J. Schubert, S. Van Elshocht, and M. Caymax, Appl. Phys. Lett. APPLAB 0003-6951, 89, 232902 (2006). 10.1063/1.2402121 (Pubitemid 44907269)
- (2006) Applied Physics Letters , vol.89 , Issue.23 , pp. 232902
- Thomas, R.¹ Ehrhart, P.² Luysberg, M.³ Boese, M.⁴ Waser, R.⁵ Roeckerath, M.⁶ Rije, E.⁷ Schubert, J.⁸ Van Elshocht, S.⁹ Caymax, M.¹⁰

7
- 41049085342
- APPLAB 0003-6951, 10.1063/1.2894573
- C. Adelmann, S. Van Elshocht, A. Franquet, T. Conard, O. Richard, H. Bender, P. Lehnen, and S. De Gendt, Appl. Phys. Lett. APPLAB 0003-6951, 92, 112902 (2008). 10.1063/1.2894573
- (2008) Appl. Phys. Lett. , vol.92 , pp. 112902
- Adelmann, C.¹ Van Elshocht, S.² Franquet, A.³ Conard, T.⁴ Richard, O.⁵ Bender, H.⁶ Lehnen, P.⁷ De Gendt, S.⁸

8
- 76349120101
- Unpublished work
- J. P. Chu, D. Y. Yu, C. H. Wu, and S. F. Wang, Unpublished work.
- Chu, J.P.¹ Yu, D.Y.² Wu, C.H.³ Wang, S.F.⁴

9
- 0003998388
- 65th ed., CRC Press, Boca Raton, FL
- CRC Handbook of Chemistry and Physics, 65th ed., pp. D-33-D-36, CRC Press, Boca Raton, FL (1984).
- (1984) CRC Handbook of Chemistry and Physics

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