Effect of substrate on processing of multi-gun sputter deposited, near-stoichiometric Ni2MnGa thin films

Thin Solid Films

Volumn 518, Issue 10, 2010, Pages 2659-2664

  Bayer, B C ^a   Khan, A F ^b   Mehmood, M ^b   Barber, Z H ^a  

^a UNIVERSITY OF CAMBRIDGE   (United Kingdom)

^b PAKISTAN INSTITUTE OF ENGINEERING AND APPLIED SCIENCES   (Pakistan)

Author keywords

Ferromagnetic shape memory alloys; Heat treatment; Silicides; Sputtering

Indexed keywords

CHARACTERISATION; DIFFERENT SUBSTRATES; FERROMAGNETIC SHAPE MEMORY ALLOY; FERROMAGNETIC SHAPE MEMORY ALLOYS; FILM PROPERTIES; HEAT TREATMENT TEMPERATURE; HEATING TEMPERATURES; IN-VACUUM; ROOM TEMPERATURE; SAPPHIRE SUBSTRATES; SILICIDE FORMATION; SILICON DIOXIDE; SILICON SUBSTRATES; THERMAL EXPANSION COEFFICIENTS;

DEPOSITION; FERROMAGNETIC MATERIALS; FERROMAGNETISM; HEAT TREATMENT; MECHANICAL STABILITY; SAPPHIRE; SHAPE MEMORY EFFECT; SILICA; SILICIDES; SILICON ALLOYS; SUBSTRATES; THERMAL EXPANSION; THIN FILMS;

GALLIUM ALLOYS;

EID: 76249096208     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2009.08.030     Document Type: Article

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