High-aspect-ratio metal microchannel plates for microelectronic cooling applications

Journal of Micromechanics and Microengineering

Volumn 20, Issue 2, 2010, Pages

  Yu, W ^a   Desmulliez, M P Y ^b   Drufke, A ^b   Leonard, M ^b   Dhariwal, R S ^b   Flynn, D ^b   Bognar G ^c   Poppe, A ^c   Horvath, G ^c   Kohari, Z ^c   Rencz, M ^c  

^a CHANGCHUN INSTITUTE OF OPTICS   (China)

^b HERIOT WATT UNIVERSITY   (United Kingdom)

^c BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS   (Hungary)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING APPLICATIONS; COOLING CHARACTERISTICS; ELECTROPLATED COPPER; HIGH ASPECT RATIO; MANUFACTURING PROCESS; METAL MICROSTRUCTURE; MICRO CHANNEL PLATE; MICRO-CHANNEL COOLING PLATE; PLATE TECHNOLOGIES; UV LIGA;

COOLING; HEAT RESISTANCE; IMAGE STORAGE TUBES; MICROCHANNELS; MICROELECTRONICS; NICKEL ALLOYS; PRESSURE DROP;

ASPECT RATIO;

EID: 75649087702     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/20/2/025004     Document Type: Article

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