Electro-kinetic microchannel cooling system for desktop computers

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn 20, Issue , 2004, Pages 26-29

  Zhou, Peng ^a   Horn, James ^a   Upadhya, Girish ^a   Goodson, Ken ^a   Munch, Mark ^a  

^a Cooligy Inc ^*  (United States)

Author keywords

Electro kinetic pump; Liquid cooling; MicroChannel; Thermal management

Indexed keywords

BALL GRID ARRAY (BGA) PACKAGES; ELECTRO-KINETIC PUMPS; LIQUID COOLING; MICROCHANNELS; THERMAL INTERFACE MATERIALS (TIM); THERMAL MANAGEMENT;

COMPUTER SIMULATION; COOLING SYSTEMS; HEAT FLUX; HEAT TRANSFER; PERSONAL COMPUTERS; PRESSURE DROP; PRINTED CIRCUIT BOARDS; RADIATORS;

COOLING;

EID: 2342625208     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (1)

1. Jiang, L., Mikkelsen, J., Koo, J., Hube,r D., Yao, S., Zhang, L., Zhou, P., Maveety, J.G., Prasher R., Santiago, J.G., Kenny, T.W., Goodson, K.E., "Closed-Loop Electroosmotic Microchannel Cooling System for VLSI Circuits", IEEE Transactions on Components & Packaging Technologies, in press, 2002.