Cross-verification of thermal characterization of a microcooler

Journal of Electronic Packaging

Volumn 129, Issue 2, 2007, Pages 167-171

  Kohari Zs ^a   Bognar Gy ^a   Horvath Gy ^a   Poppe, A ^a   Rencz, M ^a   Szekely V ^a  

^a BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS   (Hungary)

Author keywords

[No Author keywords available]

Indexed keywords

HEAT FLUX; HEAT RESISTANCE; HEAT TRANSFER; MICROCHANNELS; TEMPERATURE SENSORS; TRANSISTORS;

MICROCOOLERS; RADIAL ARRANGEMENT; THERMAL CHARACTERIZATION;

COOLING SYSTEMS;

EID: 38749089402     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2721089     Document Type: Article

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