Compressibility effects in the design of gas-cooled microchannel heat sinks

Thermal Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 1996, Pages 124-129

  Marongiu, Maurice J ^a  

^a MJM Engineering Co   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPRESSIBLE FLOW; COOLING; FLOW MEASUREMENT; HEAT LOSSES; HEAT TRANSFER; HEAT TRANSFER COEFFICIENTS; LAMINAR FLOW; MULTICHIP MODULES; PRESSURE DROP;

GAS COOLED MICROCHANNEL HEAT SINKS; THERMAL MANAGEMENT;

HEAT SINKS;

EID: 0029705729     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)