Fabrication and characterization of a low-cost, wafer-scale radial microchannel cooling plate

IEEE Transactions on Components and Packaging Technologies

Volumn 32, Issue 1, 2009, Pages 20-29

  Desmulliez, M P Y ^a   Pang, A J ^b   Leonard, M ^a   Dhariwal, R S ^a   Yu, W ^a   Abraham, E ^a   Bognar Gy ^c   Poppe, A ^c   Horvath, Gy ^c   Kohari, Zs ^c   Rencz, M ^c   Emerson, D ^d   Barber, R W ^d   Slattery, O ^e   Waldron, F ^e   Cordero, N ^e  

^a HERIOT WATT UNIVERSITY   (United Kingdom)

^b INSTITUTE OF BIOENGINEERING AND NANOTECHNOLOGY   (Singapore)

^c BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS   (Hungary)

^d DARESBURY LABORATORY   (United Kingdom)

^e UNIVERSITY COLLEGE CORK   (Ireland)

Author keywords

Cooling devices; Microchannel; Modeling and simulation; Thermal management; UV LIGA

Indexed keywords

CHIP SCALE PACKAGES; COOLING; ELECTROFORMING; FABRICATION; MICROELECTRONICS; NICKEL ALLOYS; PLATES (STRUCTURAL COMPONENTS); TEMPERATURE CONTROL;

COOLING DEVICES; MICROCHANNEL; MODELING AND SIMULATION; THERMAL MANAGEMENT; UV-LIGA;

MICROCHANNELS;

EID: 63249119183     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2008.2002434     Document Type: Article

References (19)

1. SEMATECH, International Technology Roadmap for Semiconductors - Assembly and Packaging, ITRS 2005 Update, 2005.
2. I. Sauciuc, G. Chrysler, R. Mahajan, and M. Szleper, "Air-cooling extension - Performance limits for processor cooling applications," in Proc. 20th SEMI-THERM Symp., San Jose, CA, Mar. 11-13, 2003, pp. 74-80.
3. S. V. Garimella, "Advances in mesoscale thermal management technologies for microelectronics," in Proc. 10th THERMINIC Workshop, Sophia-Antipolis, France, 29 Sep.-Oct. 2004, pp. 185-206.
4. P. Rogers and V. Eveloy, in Proc. IEEE 5th Int. Conf. Thermal and Mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSim E, 2004, pp. 527-529.
5. R. Hahan, A. Kamp, A. Ginolas, M. Schmidt, J. Wolf, V. Glaw, M. Toepper, O. Ehrmann, and H. Reichl, "High power multichip modules employing the planar embedding technique and microchannel water heat sinks," IEEE Trans. Compon., Packag., Manuf. Technol., vol. 20, no. 4, pt. A, pp. 432-441, Dec. 1997.
6. A. J. Pang, M. P. Y. Desmulliez, M. Leonard, R. S. Dhariwal, R. L. Reuben, A. S. Holmes, G. Hong, K. R. Pullen, F.Waldron, O. Slattery, M. Rencz, D. R. Emerson, and R. W. Barber, "Design, manufacture and testing of a low-cost microchannel cooling device," in IEEE Proc. 6th Electron. Packag. Technol. Conf., Singapore, Dec. 8-10, 2004, pp. 564-568, ISBN 0-7803-8821-6.
7. L. Zhang, K. E. Goodson, and T. W. Kenny, Silicon Microchannel Heat Sinks. New York: Springer-Verlag, 2004.
8. D. B. Tuckerman and R. F. Pease, "High-performance heat sinking for VLSI," IEEE Electron. Device Lett., vol. EDL-2, no. 5, pp. 126-129, Sep. 1981.
9. Y. Joo, K. Dieu, and C.-J. Kim, "Fabrication of monolithic microchannels for IC chip cooling," in Proc. IEEE Micro Electro Mechanical Systems (MEMS'95), Jan 29-Feb 2 1995, pp. 362-367.
10. C. Li and R. A. Wirtz, "Development of a high performance heat sink based on screen-fin technology," in Proc. 20th SEMI-THERM Symp., San Jose, CA, Mar. 11-13, 2003, pp. 53-60.
11. F. M, White, Fluid Mechanics. New York: McGraw-Hill, 1991.
12. "CFD-ACE+ User Manual (2006) ESI CFD," Huntsville, AL, 2006.
13. R. W. Barber and D. R. Emerson, "Challenges in modeling gas-phase flow in microchannels: From slip to transition," Heat Transf. Eng., vol. 27, no. 4, pp. 3-12, 2006.
14. B. S. Siegal, "Measuring thermal resistance is the key to a cool semiconductor," Electronics, vol. 51, pp. 121-126, 1978.
15. Székely, "Tran van bien, Fine structure of heat flow path in semiconductor devices: A measurement and identification method," Solid-State Electron., vol. 31, no. 9, pp. 1363-1368, 1988.
16. V. Székely et al., "New way of thermal transient testing," in Proc. 15th SEMI-THERM Symp., San Diego, CA, Mar. 9-11, 1999, pp. 182-188.
17. M. Rencz et al., "Determining partial thermal resistances with transient measurements and using the method to detect die attach discontinuities," in Proc. 18th SEMI-THERM Symp., San Jose, CA, Mar. 10-14, 2002, pp. 15-20.
18. M. Rencz, A. Poppe, E. Kollár, S. Ress, V. Székely, and B. Courtois, "A procedure to correct the error in the structure function based thermal measuring methods," in Proc. 20th SEMI-THERM Symp., San Jose, CA, Mar. 9-11, 2004, pp. 92-98.
19. V. Székely, "A new evaluation method of thermal transient measurement results," Microelectron. J., vol. 28, pp. 277-292, 1997.