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Volumn 357, Issue 1 PART 3, 2007, Pages 41-47
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Etch properties of Hf-based high-K dielectrics using inductively coupled plasma
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Author keywords
Etching; HfO2; High k materials; Inductively coupled plasma; Quadrupole mass spectrometry
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Indexed keywords
BROMINE OXIDE;
CHEMICAL ETCHING;
ENERGY DEPENDENCY;
ETCH PROPERTIES;
ETCH RATES;
ETCHING CHARACTERISTICS;
HFO2;
HIGH-K DIELECTRIC;
HIGH-K MATERIALS;
INDUCTIVE COUPLED PLASMA;
MASS SPECTRA;
QUADRUPOLE MASS SPECTROMETRY;
VOLATILE SPECIES;
BROMINE;
CHLORINE COMPOUNDS;
DIELECTRIC MATERIALS;
ETCHING;
FERROELECTRICITY;
HAFNIUM;
HAFNIUM COMPOUNDS;
MASS SPECTROMETERS;
MASS SPECTROMETRY;
PHOTORESISTS;
SEMICONDUCTING SILICON COMPOUNDS;
INDUCTIVELY COUPLED PLASMA;
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EID: 75449114645
PISSN: 00150193
EISSN: 15635112
Source Type: Journal
DOI: 10.1080/00150190701527605 Document Type: Conference Paper |
Times cited : (2)
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References (12)
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