Nanotechnology and active thin films for compact RF components and agile systems

Ferroelectrics

Volumn 342, Issue 1, 2006, Pages 163-182

  Perlman, Barry ^a   Katehi, Linda ^b   Ballato, Arthur ^a   Engheta, Nader ^c   Peroulis, Dimitris ^b   Mohammadi, Saeed ^b  

^a US Army Research Development and Engineering Command   (United States)

^b PURDUE UNIVERSITY   (United States)

^c UNIVERSITY OF PENNSYLVANIA   (United States)

Author keywords

Active thin films; Agile communications; Antennas; Sensors

Indexed keywords

ACTIVE THIN FILMS; AGILE COMMUNICATIONS; CELL PHONE; CMOS COMPATIBLE; COMMUNICATIONS EQUIPMENT; DENSE NETWORK; EXTERNAL FIELDS; EXTERNAL OPTICAL SIGNALS; FILTER TECHNOLOGY; FREQUENCY SELECTIVE SURFACES; FREQUENCY SOURCE; HIGH MOBILITY; HIGH QUALITY; HIGH STABILITY; HIGH-DENSITY; HIGH-Q PASSIVES; LOW NOISE; NANO SCALE; NON-LINEAR; ON-CHIP FILTERS; OUT-OF-BAND; RECONFIGURABLE SYSTEMS; RF COMPONENTS; SPACE-FILLING; STEERABLE ANTENNA ARRAYS; SURFACE CHARACTERISTICS; SYSTEM-ON-A-CHIP ARCHITECTURES; TACTICAL COMMUNICATIONS; THIN FILM RESONATORS; THIN-FILM ELEMENTS; TUNABLE FILTERS;

ANTENNAS; APPLICATION SPECIFIC INTEGRATED CIRCUITS; BANDPASS FILTERS; CARBON NANOTUBES; CELLULAR TELEPHONE SYSTEMS; COMMUNICATION; ELECTROMAGNETIC WAVE POLARIZATION; INCLUSIONS; METAMATERIALS; NANOTECHNOLOGY; RESONATORS; SENSORS; STEERABLE ANTENNAS; THIN FILM DEVICES; THIN FILMS; VAPOR DEPOSITION; WIRELESS NETWORKS;

AGILE MANUFACTURING SYSTEMS;

EID: 75449104667     PISSN: 00150193     EISSN: 15635112     Source Type: Journal    
DOI: 10.1080/00150190600946328     Document Type: Conference Paper

References (40)

1. IEE Review 49(4), 35-48 (April 2003). Special Report: Nanotechnology.
2. G. M. Rebeiz, RF MEMS Theory, Design, and Technology, John Wiley & Sons, (2003).
3. R. E. Mihailovich, et al., MEM Relay for reconfigurable RF circuits, IEEE Microwave & Wireless Components Lett. 11(2), 53-55 (February 2001).
4. P. M. Zavracky, et al., Microswitches and microrelays with a view toward microwave applications, Intl. J. RF & Microwave Computer-Aided Eng. 9(4), 338-347 (July 1999).
5. D. Peroulis, et al., Electromechanical considerations in developing low-voltage RF MEMS switches, IEEE Trans. Microwave Theory Tech. 51, 259-270 (January 2003).
6. S. Duffy, et al., MEMS Microswitches for reconfigurable microwave circuitry, IEEE Microwave & Wireless Components Lett. 11(3), 106-108 (March 2001).
7. 3 interdigital capacitors for microwave applications, In Proc. 2003 Asia-Pacific Microwave Conf., Nov. 2003, Seoul, South Korea.
8. A. Margomenos, et al., Fabrication and accelerated hermeticity testing of an on-wafer package for RF MEMS, IEEE Trans. Microwave Theory Tech. 52(6), 1626-1635 (June 2004).
9. D. Peroulis, A. Margomenos, Y. Lu, and L. P.B. Katehi, Packaging technology for RF MEMS switches, GOMAC 2005, Las Vegas, Nevada, April 2005.
10. A. Margomenos, et al., High frequency parasitic effects for on-wafer packaging of RF MEMS switches, IEEE MTT-S Intl. Symp. Digest, pp. 1875-1878, Philadelphia, PA, (June 2003).
11. A. Margomenos, et al., Ultra-wideband three dimensional transitions for on-wafer packages, European Microwave Conference, Amsterdam, The Netherlands, (2004).
12. M. Chia, et al., Accelerated hermeticity testing of a glass-silicon package performed by rapid thermal processing aluminum-to-silicon nitride bonding, Sensors & Actuators A, 97-98, 405-409 (2002).
13. Y. T. Cheng, et al., A hermetic glass-silicon package formed using localized aluminum/silicon-glass bonding, J. Microelectromechanical Systs. 10, 392-399 (Sept. 2001).
14. S. Peck, Comprehensive model for humidity testing correlation, Proc. 24th Ann. Reliability Physics Symp. 44-50, Anaheim, CA, 1986.
15. D. Halliberg, et al., Recent humidity accelerations, a base for testing standards, Qual. Reliab. Eng. Int. 7, 169-180 (1991).
16. A. Ballato, Piezoelectricity: Old effect, new thrusts, IEEE Trans. Ultrason., Ferroelec. Freq. Contr. 42(5), 916-926 (1995).
17. S. Hadlington, Hot rocks, IEE Review 51(4), 30-33 (April 2005).
18. L. Vegard, Die Konstitution der Mischkristalle und die Raumfülling der Atome, Zeits. für Physik 5, 17-26, (1921).
19. W. P. Mason, Piezoelectric Crystals and their Application to Ultrasonics, Van Nostrand, New York, (1950).
20. Q.-X. Su, P. Kirby, E. Komuro, M. Imura, Q. Zhang, and R. Whatmore, Thin-film bulk acoustic resonators and filters using ZnO and lead-zirconium-titanate thin films, IEEE Trans. Microwave Theory Tech. 49(4), 769-778 (April 2001).
21. R. Weigel, D. P. Morgan, J. M. Owens, A. Ballato, K. M. Lakin, K. Hashimoto, and C. C. W. Ruppel, Microwave acoustic materials, devices and applications, IEEE Trans. Microwave Theory Tech. 50(3), 738-749 (March 2002).
22. R. Bechmann, Piezoelektrische Quarzoszillatoren mit beliebigem Temperaturkoeffizienten, insbesondere dem Wert Null, Die Naturwissenschaften 21(42), 752 (1933).
23. D. B. Fraser, J. T. Krause, and A. H. Meitzler, Physical limitations on the performance of vitreous silica in high-frequency ultrasonic and acousto-optical devices, Appl. Phys. Lett. 11(10), 308-310 (15 November 1967).
24. J. Söderkvist and K. Hjort, The piezoelectric effect of GaAs used for resonators and resonant sensors, J. Micromech. Microeng. 4, 28-34 (1994).
25. H. Ledbetter and S. Kim, Monocrystal Elastic Constants and Derived Properties of the Cubic and the Hexagonal Elements, Vol. II, pp. 97-106, In Handbook of Elastic Properties of Solids, Liquids, and Gases (Academic Press, San Diego, CA, 2001).
26. M. Grimsditch, Brillouin Scattering, Vol. I, pp. 331-347, In Handbook of Elastic Properties of Solids, Liquids, and Gases (Academic Press, San Diego, CA, 2001).
27. D. G. Isaak, Elastic Properties of Minerals and Planetary Objects, Vol. III, pp. 325-376, In Handbook of Elastic Properties of Solids, Liquids, and Gases (Academic Press, San Diego, CA, 2001).
28. T. Goto, O. L. Anderson, I. Ohno, and S. Yamamoto, Elastic constants of corundum up to 1825 K, J. Geophysical Res. 94B(6), 7588-7602 (10 June 1989).
29. A. Ballato, Resonance in piezoelectric vibrators, Proc. IEEE 58(1), 149-151 (January 1970).
30. P. M. Chaikin and T. C. Lubensky, Principles of Condensed Matter Physics (Cambridge Univ. Press, 1995).
31. J. McVay, N. Engheta, and A. Hoorfar, High-impedance metamaterial surfaces using Hilbert-curve inclusions, IEEE Microwave & Wireless Components Lett. 14(3), 130-132 (March 2004).
32. J. McVay, A. Hoorfar, and N. Engheta, Peano high-impedance surfaces, in Radio Science, URSI EMT Pisa Special Issue, in press.
33. N. Engheta, A. Salandrino, and A. Alu, Circuit elements at optical frequencies: Nanoinductors, nanocapacitors, and nanoresistors, Phys. Rev. Lett. in press.
34. S. Ijima, Helical microtubules of graphitic carbon, Nature 354, 56 (1991).
35. A. Krishnan, et al., Young's modulus of single-walled nanotubes, Phys. Rev. B 58(20), 14013-14019 (15 November 1998).
36. M. S. Dresselhaus, Nanotubes: Burn and interrogate, Science 292, 650-651 (2001).
37. S. Peng, et al., Carbon nanotube chemical and mechanical sensors, 3rd Intl. Workshop on Structural Help Monitoring, 2003.
38. V. Sazonova, et al., A tunable carbon nanotube electromechanical oscillator, Nature, 431, 284-287 (2004).
39. L. Rabieirad, S. Kim, M. Shim and S. Mohammadi, Doubly clamped single-walled carbon nanotube resonators operating in MHz frequencies, submitted to IEEE conference on Nanotechnology (Nagoya, Japan, July 2005).
40. L. Rabieirad, S. Kim and S. Mohammadi, Carbon nanotube as a mixer in MHz frequencies, submitted to IEEE Intl. Electron Device Meeting (Washington, DC, December 2005).