Microwave acoustic materials, devices, and applications

IEEE Transactions on Microwave Theory and Techniques

Volumn 50, Issue 3, 2002, Pages 738-749

  Weigel, Robert ^a,b   Morgan, David P ^a,c   Owens, John M ^a,d   Ballato, Arthur ^a,e   Lakin, Kenneth M ^a,f   Hashimoto, Ken Ya ^a,g   Ruppel, Clemens C W ^a,h  

^a IEEE   (Austria)

^b JOHANNES KEPLER UNIVERSITY LINZ   (Austria)

^c Boise State University ^*  (United Kingdom)

^d BOISE STATE UNIVERSITY   (United States)

^e US Army Communications and Electronics Command   (United States)

^f TFR Technologies Inc   (United States)

^g CHIBA UNIVERSITY   (Japan)

^h SIEMENS AG   (Germany)

Author keywords

BAW; Bulk acoustic wave devices; Communications and sensor applications; SAW; Signal processing; Surface acoustic wave devices

Indexed keywords

ACOUSTIC SURFACE WAVE DEVICES; ELECTROACOUSTIC TRANSDUCERS; MICROWAVE FILTERS; RESONATORS; SIGNAL PROCESSING; THIN FILMS;

BULK ACOUSTIC WAVES (BAW); MICROWAVE ACOUSTIC MATERIALS;

MICROWAVE ACOUSTIC DEVICES;

EID: 0036500853     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/22.989958     Document Type: Review

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