Improved dense via yields of Cu/CVD low k Coral™ dual damascene metallization at post Cu cap etch wet clean

Microelectronic Engineering

Volumn 75, Issue 4, 2004, Pages 433-442

  Tsang, C F ^a   Chang, C K ^a   Su, Y J ^a   Li, H Y ^a   Wong, L Y ^a   Li, W H ^a   Koh, M L ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

Cu dual damascene; Electrical performance; Low k dielectrics; Post etch wet clean

Indexed keywords

ACOUSTIC WAVE PROPAGATION; ELECTRIC FIELDS; ETCHING; METALLIZING; OPTIMIZATION; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; POLYMERS; SPRAYING; SPUTTERING; THIN FILMS;

CU DUAL DAMASCENE; ELECTRICAL PERFORMANCE; LOW K DIELECTRICS; POST-ETCH WET CLEAN; WAFER CLEANING;

COPPER;

EID: 7544249095     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2004.07.065     Document Type: Article

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