Exploring advanced interconnect reliability

Semiconductor International

Volumn 25, Issue 8, 2002, Pages 63-72

  Peters, Laura ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; COPPER; DIFFUSION; ELECTROMIGRATION; ELECTRONICS PACKAGING; SILICON; STRESS ANALYSIS; TANTALUM COMPOUNDS; THERMAL EXPANSION;

COEFFICIENTS OF THERMAL EXPANSION (CTE); DUAL-DAMASCENE (DD); GRAIN BOUNDARY DIFFUSIONS; MOTOROLA (CO);

DIELECTRIC DEVICES;

EID: 3142624974     PISSN: 01633767     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Review

References (4)

1. E.T. Ogama, "Stress-Induced Voiding Under Vias Connected to Wide Cu Metal Leads," IEEE International Reliability Physics Symposium Proc., April 2002.
2. M. Rasco, "Packaging Assessment of Porous Ultra Low-k Materials," IEEE International Interconnect Technology (IITC) Conf. Proc., June 2002, p. 113.
3. L. Mercado, C. Goldberg and M. Kuo, "Simulation Method for Predicting Packaging Mechanical Reliability With Low-k Dielectrics," IITC Proc., May 2002, p.119.
4. G. Xu, "Cohesive Strength Characterization of Brittle Low-k Films," IITC Proc., 2002, p. 57.