Thermal properties of wood-derived copper-silicon carbide composites fabricated via electrodeposition

Composites Science and Technology

Volumn 70, Issue 3, 2010, Pages 478-484

  Pappacena, K E ^a   Johnson, M T ^a   Wang, H ^b   Porter, W D ^b   Faber, K T ^a  

^a Northwestern University   (United States)

^b OAK RIDGE NATIONAL LABORATORY   (United States)

Author keywords

A. Ceramic matrix composites (CMCs); B. Thermal properties; C. Anisotrophy; C. Finite element analysis (FEA); Thermal conductivity

Indexed keywords

C. ANISOTROPHY; EFFECTIVE CONDUCTIVITY; EFFECTIVE THERMAL CONDUCTIVITY; FINITE ELEMENT ANALYSIS; FLASH DIFFUSIVITY; HEAT FLUX DISTRIBUTIONS; OBJECT ORIENTED; ORIENTED COMPOSITES; SILICON CARBIDE COMPOSITES; THERMAL PROPERTIES;

CARBON FIBER REINFORCED PLASTICS; CERAMIC MATERIALS; COPPER; ELECTRODEPOSITION; FINITE ELEMENT METHOD; HEAT FLUX; MICROSTRUCTURE; SILICON CARBIDE; THERMAL CONDUCTIVITY; THERMOANALYSIS;

CERAMIC MATRIX COMPOSITES;

ANISOTROPY; COMPOSITE; FINITE ELEMENT ANALYSIS; MATHEMATICAL MODEL; MICROSTRUCTURE; THERMAL CONDUCTIVITY; THERMAL PROPERTY;

EID: 75149160382     PISSN: 02663538     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compscitech.2009.11.011     Document Type: Article

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