Thermal conductivity of porous silicon carbide derived from wood precursors

Journal of the American Ceramic Society

Volumn 90, Issue 9, 2007, Pages 2855-2862

  Pappacena, K E ^a   Faber, K T ^a   Wang, H ^b   Porter, W D ^b  

^a Northwestern University

^b OAK RIDGE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HIGH TEMPERATURE EFFECTS; SILICON CARBIDE; THERMAL CONDUCTIVITY; WOOD;

BIOMORPHIC SILICON CARBIDE (BIOSIC); FLASH DIFFUSIVITY; HEAT-FLOW PATHS; SPECIFIC HEAT MEASUREMENTS;

POROUS SILICON;

HIGH TEMPERATURE; SILICON CARBIDE; THERMAL CONDUCTIVITY; WOOD;

EID: 34548488693     PISSN: 00027820     EISSN: 15512916     Source Type: Journal    
DOI: 10.1111/j.1551-2916.2007.01777.x     Document Type: Article

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