Processing of wood-derived copper-silicon carbide composites via electrodeposition

Composites Science and Technology

Volumn 70, Issue 3, 2010, Pages 485-491

  Pappacena, K E ^a   Johnson, M T ^a   Xie, S ^a   Faber, K T ^a  

^a Northwestern University   (United States)

Author keywords

A. Ceramic matrix composites (CMCs); B. Interface; D. Transmission electron microscopy (TEM); D. X ray diffraction (XRD); Electrodeposition

Indexed keywords

A. CERAMIC-MATRIX COMPOSITES (CMCS); D. X-RAY DIFFRACTION (XRD); ELECTRODEPOSITION TECHNIQUE; PLATING EFFICIENCY; PROCESSING METHOD; PROCESSING TECHNIQUE; ROOM TEMPERATURE; SILICON CARBIDE COMPOSITES; TEM; WOOD TYPES;

ASPECT RATIO; CERAMIC MATERIALS; DIFFRACTION; ELECTRODEPOSITION; IMAGE ANALYSIS; MICROSTRUCTURE; PHASE INTERFACES; PROCESSING; SILICON CARBIDE; TRANSMISSION ELECTRON MICROSCOPY; WOOD; X RAY DIFFRACTION;

CERAMIC MATRIX COMPOSITES;

CERAMICS; COMPOSITES; ELECTROPLATING; IMAGE ANALYSIS; INTERFACES; SILICON CARBIDE; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION;

CERAMICS; COMPOSITE; IMAGE ANALYSIS; INTERFACIAL PROPERTY; MICROSTRUCTURE; TEMPERATURE;

EID: 75149132442     PISSN: 02663538     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compscitech.2009.12.019     Document Type: Article

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