The microstructure and the thermal expansion characteristics of Cu/Si Cp composites

Materials Science and Engineering: A

Volumn 349, Issue 1-2, 2003, Pages 236-247

  Shu, Kuen Ming ^a   Tu, G C ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

Coefficient of thermal expansion; Cu SiCp composites; Electroless plating; Microstructure; Powder metallurgy; Thermal hysteresis strain

Indexed keywords

CHEMICAL BONDS; COPPER COMPOUNDS; ELECTROLESS PLATING; MICROSTRUCTURE; POWDER METALLURGY; RESIDUAL STRESSES; SILICON CARBIDE; THERMAL EXPANSION;

INTERFACIAL BONDING;

COMPOSITE MATERIALS;

COMPOSITE; COPPER; ELECTROLESS PLATING; FIBER-REINFORCED MATERIAL; MICROSTRUCTURE; THERMAL ANALYSIS;

EID: 0038669178     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5093(02)00788-8     Document Type: Article

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