Advances in LED packaging and thermal management materials

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6910, Issue , 2008, Pages

  Zweben, Carl ^a  

^a Adv Packaging Materials Consultant   (United States)

Author keywords

Carbon; Coefficient of thermal expansion; Composites; Graphite; LEDs; Light emitting diodes; Manufacturing; Materials; Packaging; Thermal conductivity; Thermal management; Thermal stresses

Indexed keywords

ALLOYS; ALUMINUM; ALUMINUM ALLOYS; ALUMINUM METALLOGRAPHY; CARBON; CARBON CARBON COMPOSITES; CARBON FIBER REINFORCED PLASTICS; CARBON NANOTUBES; CONDUCTIVE MATERIALS; COPPER; CUBIC BORON NITRIDE; DIODES; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS INDUSTRY; FULLERENES; INDUSTRIAL RESEARCH; LIGHT EMISSION; LIGHT EMITTING DIODES; LIGHT METALS; MANAGEMENT; MATERIALS PROPERTIES; METALS; MICROELECTRONICS; PACKAGING; PIGMENTS; POLYCHLORINATED BIPHENYLS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUITS; REINFORCED PLASTICS; STRENGTH OF MATERIALS; STRESSES; TEMPERATURE CONTROL; THERMAL CONDUCTIVITY; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL EXPANSION; THERMAL INSULATING MATERIALS; THERMAL SPRAYING; THERMAL STRESS; THERMAL VARIABLES CONTROL; THERMODYNAMIC PROPERTIES; THERMOELASTICITY; THERMOELECTRICITY;

(8 HYDROXY QUINOLINE) ALUMINUM; (O-SEC.-BUTYLDITHIOCARBONATIO-S ,S') COPPER; (PL) PROPERTIES; 20TH CENTURY; ADVANCED MATERIALS; CIRCUIT BOARDS; COEFFICIENTS OF THERMAL EXPANSION (CTE); FUTURE DIRECTIONS; HEAT DISSIPATION; HIGH THERMAL; HIGH-VOLUME PRODUCTION; LED PACKAGING; LIGHT-EMITTING; LIGHT-EMITTING DIODES; LOW COSTS; MANUFACTURING PROBLEMS; PACKAGING ISSUES; POWER LEVELING;

PACKAGING MATERIALS;

EID: 42149134153     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.761839     Document Type: Conference Paper

References (15)

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