Ultrahigh-thermal-conductivity packaging materials

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2005, Pages 168-174

  Zweben, Carl ^a  

^a Adv Packaging Materials Consultant   (United States)

Author keywords

Carbon; Coefficient of thermal expansion; Composites; Diamond; Graphite; Laser diode packaging; LED packaging; Materials; Microprocessor packaging; Thermal conductivity; Thermal management; Thermal stresses

Indexed keywords

COEFFICIENT OF THERMAL EXPANSION; LASER DIODE PACKAGING; LED PACKAGING; MICROPROCESSOR PACKAGING; THERMAL MANAGEMENT;

DIAMONDS; GRAPHITE; LIGHT EMITTING DIODES; MICROELECTRONICS; THERMAL CONDUCTIVITY; THERMAL STRESS;

ELECTRONICS PACKAGING;

EID: 28144444206     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

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