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Volumn 404, Issue 23-24, 2009, Pages 4667-4670
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Kinetics of reverse resistance recovery of silicon diodes: The role of the distance the metallurgical p+n-junction-defect layer formed by 250 MeV krypton implantation
b
SPE Integral
(Belarus)
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Author keywords
Carrier lifetime; Ion irradiation; Reverse resistance recovery time
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Indexed keywords
DEFECT LAYERS;
FLUENCES;
HIGH ENERGY;
ION FLUENCES;
ION IRRADIATION;
KRYPTON IONS;
P-N JUNCTION;
RECOVERY TIME;
REVERSE CURRENTS;
REVERSE RESISTANCE RECOVERY TIME;
SILICON DIODES;
TRANSIENT PROCESS;
TWO PHASIS;
VACANCY DISTRIBUTION;
CARRIER LIFETIME;
CURRENT VOLTAGE CHARACTERISTICS;
DIODES;
IONS;
IRRADIATION;
KRYPTON;
METALLURGY;
RECOVERY;
SEMICONDUCTING SILICON COMPOUNDS;
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EID: 74449084831
PISSN: 09214526
EISSN: None
Source Type: Journal
DOI: 10.1016/j.physb.2009.08.129 Document Type: Article |
Times cited : (4)
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References (10)
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