A non-contact, thermally-driven buckling delamination test to measure interfacial fracture toughness of thin film systems

Thin Solid Films

Volumn 518, Issue 8, 2010, Pages 2056-2064

  Goyal, S ^a   Srinivasan, K ^a   Subbarayan, G ^a   Siegmund, T ^a  

^a PURDUE UNIVERSITY   (United States)

Author keywords

Buckling delamination; Debond propagation; Interfacial toughness

Indexed keywords

AL FILMS; BUCKLING TESTS; CHIP RELIABILITY; DEBONDS; ELASTIC-PLASTIC MODEL; FILM-SUBSTRATE SYSTEMS; INTERFACIAL ADHESIONS; INTERFACIAL FRACTURE TOUGHNESS; INTERFACIAL TOUGHNESS; METAL LAYER; MICROELECTRONICS INDUSTRY; NON-CONTACT; PATTERNED FILMS; SEMICONDUCTOR CHIPS; SILICON SUBSTRATES; THIN FILM SYSTEMS; WEAK INTERFACE;

BUCKLING; COMPRESSIVE STRESS; DELAMINATION; DIELECTRIC MATERIALS; FRACTURE; HEATING; MICROELECTRONICS; STEEL SHEET; SUBSTRATES; TENSILE STRESS; TESTING; THIN FILM DEVICES; THIN FILMS;

FRACTURE TOUGHNESS;

EID: 73949159461     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2009.07.148     Document Type: Article

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