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Volumn 46, Issue 3, 1998, Pages 389-410

Measurement of thin film interface toughness by using laser-generated stress pulses

Author keywords

A. delamination; A. dynamic fracture; A. fracture toughness; C. optical interferometry; Thin film

Indexed keywords

COMPRESSIVE STRESS; COMPUTER SIMULATION; CRACK INITIATION; DELAMINATION; INTERFACES (MATERIALS); INTERFEROMETRY; LASER PULSES; MICROCRACKS; RESIDUAL STRESSES; SURFACES; TENSILE PROPERTIES; THIN FILMS;

EID: 0032017106     PISSN: 00225096     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0022-5096(97)00081-1     Document Type: Article
Times cited : (37)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.