Electrodeposition of submicron/nanoscale Cu2O/Cu junctions in an ultrathin CuSO4 solution layer

Journal of Electroanalytical Chemistry

Volumn 638, Issue 2, 2010, Pages 225-230

  Yu, Guangwei ^a   Hu, Xiaobo ^a   Liu, Duo ^a   Sun, Daliang ^a   Li, Jing ^a   Zhang, Huaijin ^a   Liu, Hong ^a   Wang, Jiyang ^a  

^a SHANDONG UNIVERSITY   (China)

Author keywords

Abnormal growth; Compositional distribution; Electrodeposition; Submicron nanoscale Cu2O Cu junctions; Ultrathin CuSO4 solution layer

Indexed keywords

CRYSTALLITES; MORPHOLOGY;

ABNORMAL GROWTH; CHEMICAL ETCHING; COMPOSITIONAL DISTRIBUTION; GRAIN SIZE; GROWTH DRIVING FORCES; NANO SCALE; SAMPLE SURFACE; SOLUTION LAYERS; ULTRA-THIN;

ELECTRODEPOSITION;

EID: 73049100462     PISSN: 15726657     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jelechem.2009.11.004     Document Type: Article

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