Self-assembly of copper micro/nanoscale parallel wires by electrodeposition on a silicon substrate

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Volumn 2, Issue 6, 2006, Pages 727-731

  Zhang, Mingzhe ^a   Zuo, Guihong ^a   Zong, Zhaocun ^a   Cheng, Haiyong ^a   He, Zhi ^a   Yang, Cunming ^a   Zou, Guangtian ^a  

^a JILIN UNIVERSITY   (China)

Author keywords

Arrays; Copper; Electrodeposition; Silicon

Indexed keywords

ARRAYS; COPPER COMPOUNDS; ELECTRODEPOSITION; ELECTRON DIFFRACTION; SCANNING ELECTRON MICROSCOPY; SELF ASSEMBLY; SILICON;

COPPER WIRE ARRAYS; ELECTROCHEMICAL CELL; OCTADECYLTRICHLOROSILANE (OTS); SCANNING ELECTRON MICROGRAPHS;

SEMICONDUCTOR QUANTUM WIRES;

COPPER; NANOTUBE; SILICON;

ARTICLE; CHEMISTRY; CONFORMATION; CRYSTALLIZATION; ELECTRICITY; ELECTROPLATING INDUSTRY; MACROMOLECULE; MATERIALS TESTING; METHODOLOGY; NANOTECHNOLOGY; PARTICLE SIZE; SURFACE PROPERTY; ULTRASTRUCTURE;

COPPER; CRYSTALLIZATION; ELECTRIC WIRING; ELECTROPLATING; MACROMOLECULAR SUBSTANCES; MATERIALS TESTING; MOLECULAR CONFORMATION; NANOTECHNOLOGY; NANOTUBES; PARTICLE SIZE; SILICON; SURFACE PROPERTIES;

EID: 33646738751     PISSN: 16136810     EISSN: 16136829     Source Type: Journal    
DOI: 10.1002/smll.200500338     Document Type: Article

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