Thermally induced stresses resulting from coefficient of thermal expansion differentials between an LED sub-mount material and various mounting substrates

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6486, Issue , 2007, Pages

  DeMilo, Charles ^a   Bergad, Corey ^a   Forni, Ronald ^a   Brukilacchio, Thomas ^a  

^a Innovations in Optics Inc ^*  (United States)

Author keywords

Coefficient of thermal expansion; LED packaging; Light emitting diode; Thermal conductivity; Thermal management; Thermal stresses

Indexed keywords

CERAMIC MATERIALS; ELECTRONICS PACKAGING; LIGHT EMITTING DIODES; METALLIC MATRIX COMPOSITES; TEMPERATURE CONTROL; THERMAL CONDUCTIVITY; THERMAL EXPANSION;

LED PACKAGING; MECHANICAL STRESSES; MOUNTING SUBSTRATES; SUBMOUNT MATERIAL;

THERMAL STRESS;

EID: 34248639850     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.697489     Document Type: Conference Paper

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