Crystallographic structure and mechanical behaviour of SnAgCu solder interconnects under a constant loading rate

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 677-683

  Gong, Jicheng ^a   Liu, Changqing ^a   Conway, Paul P ^a   Silberschmidt, Vadim V ^a  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTAL STRUCTURE; SINGLE CRYSTALS; SOLDERED JOINTS;

FLIP CHIP PACKAGE; HETEROGENEOUS DISTRIBUTION; SOLDER INTERCONNECTS;

SOLDERING ALLOYS;

EID: 35348837761     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373869     Document Type: Conference Paper

References (12)

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