3D die-to-wafer Cu/Sn microconnects formed simultaneously with an adhesive dielectric bond using thermal compression bonding

2008 IEEE International Interconnect Technology Conference, IITC

Volumn , Issue , 2008, Pages 46-48

  Pozder, Scott ^a   Jain, Ankur ^a   Chatterjee, Ritwik ^a   Huang, Zhihong ^a   Jones, Robert E ^a   Acosta, Eddie ^a   Marlin, Bill ^a   Hillmann, Gerhard ^b   Sobczak, Martin ^c   Kreindl, Gerald ^d   Kanagavel, Senthil ^c   Kostner, Hannes ^b   Pargfrieder, Stefan ^d  

^a FREESCALE SEMICONDUCTOR INC   (United States)

^b Datacon Technology GmbH   (Austria)

^c Cookson Electronics Semiconductor Products ^*  (United States)

^d EV GROUP   (Austria)

Author keywords

[No Author keywords available]

Indexed keywords

ABS RESINS; BOND (MASONRY); COMPUTER NETWORKS; DATA COMPRESSION; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; INTERCONNECTION NETWORKS; JOINTS (STRUCTURAL COMPONENTS); PLASTIC PARTS; RELIABILITY;

INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE; MICROCONNECTS; WAFER LEVELS;

WAFER BONDING;

EID: 50949090622     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2008.4546921     Document Type: Conference Paper

References (9)

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