SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 38, Issue 12, 2009, Pages 2470-2478

Influence of thermal cycling on the thermal resistance of solder interfaces

(3) Guo, H Y a Guo, J D a Shang, J K a,b

a INSTITUTE OF METAL RESEARCH (China)

b University of Illinois at Urbana Champaign (United States)

Author keywords

Crack propagation; Solder thermal interface materials; Thermal cycling; Thermal resistance

Indexed keywords

CRACK SEGMENTS; INTERMETALLIC COMPOUNDS; LASER FLASH METHODS; SOLDER INTERFACES; SOLDER THERMAL INTERFACE MATERIALS; THERMAL CYCLE; THERMAL INTERFACE MATERIALS; THERMAL RESISTANCE;

CRACK PROPAGATION; INTERMETALLICS; SCANNING ELECTRON MICROSCOPY; SOLDERING ALLOYS; THERMAL CYCLING; THERMAL INSULATING MATERIALS;

CRACKS;

EID: 72549084315 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-009-0857-5 Document Type: Article

Times cited : (6)

References (15)

1
- 42649105806
- Dresden, Germany
- F. Sarvar, D.C. Whalley, and P.P. Conway, Electronics System Integraion Technology conference (Dresden, Germany, 2006), p. 1292.
- (2006) Electronics System Integraion Technology Conference , pp. 1292
- Sarvar, F.¹ Whalley, D.C.² Conway, P.P.³

2
- 33645153130
- 10.1016/j.microrel.2005.01.019
- A.S. Fleischer L.H. Chang B.C. Johnson 2004 Microelectron. Reliab. 46 794 10.1016/j.microrel.2005.01.019
- (2004) Microelectron. Reliab. , vol.46 , pp. 794
- Fleischer, A.S.¹ Chang, L.H.² Johnson, B.C.³

3
- 2342598921
- X.J. Hu, L.N. Jiang, and K.E. Goodson, 20th IEEE SEMI-THERM Symposium (2004), p. 98.
- (2004) 20th IEEE SEMI-THERM Symposium , pp. 98
- Hu, X.J.¹ Jiang, L.N.² Goodson, K.E.³

4
- 0018444760
- W.T. Chen C.W. Nelson 1979 IBM J. Develop. 23 179
- (1979) IBM J. Develop. , vol.23 , pp. 179
- Chen, W.T.¹ Nelson, C.W.²

5
- 0032315127
- J. He, W.L. Morris, M.C. Shaw, and N. Sridhar, International Symposium on Microelectronics (1998), p. 583
- (1998) International Symposium on Microelectronics , pp. 583
- He, J.¹ Morris, W.L.² Shaw, M.C.³ Sridhar, N.⁴

6
- 0018482659
- D.R. Olsen and H.M. Berg, IEEE Trans. Comp. Hybrids Manuf. Technol., CHMT-2, 257 (1979).
- (1979) IEEE Trans. Comp. Hybrids Manuf. Technol., CHMT-2 , pp. 257
- Olsen, D.R.¹ Berg, H.M.²

7
- 11744336762
- 10.1063/1.1728417 1:CAS:528:DyaF38Xkt1Citg%3D%3D 1961JAP.32.1679P
- W.J. Parker R.J. Jenkins C.P. Butler G.L. Abbott 1961 J. Appl. Phys. 32 1679 10.1063/1.1728417 1:CAS:528:DyaF38Xkt1Citg%3D%3D 1961JAP....32.1679P
- (1961) J. Appl. Phys. , vol.32 , pp. 1679
- Parker, W.J.¹ Jenkins, R.J.² Butler, C.P.³ Abbott, G.L.⁴

8
- 33947286619
- R. Prasher, Proc. IEEE 94, 1571 (2006).
- (2006) Proc. IEEE , vol.94 , pp. 1571
- Prasher, R.¹

9
- 0022733693
- H. Inoue, Y. Kurihara, and H. Hachino, IEEE Trans. Comp. Hybrids. Manuf. Technol., CHMT-9, 190 (1986).
- (1986) IEEE Trans. Comp. Hybrids. Manuf. Technol., CHMT-9 , pp. 190
- Inoue, H.¹ Kurihara, Y.² Hachino, H.³

10
- 34547192333
- On the failure path in shear-tested solder joints
- DOI 10.1016/j.microrel.2006.08.021, PII S002627140600309X
- W.H. Moy Y.-L. Shen 2007 Microelectron. Reliab. 47 1300 10.1016/j.microrel.2006.08.021 (Pubitemid 47125927)
- (2007) Microelectronics Reliability , vol.47 , Issue.8 , pp. 1300-1305
- Moy, W.H.¹ Shen, Y.-L.²

11
- 71149121504
- 0790.73056 10.1016/S0065-2156(08)70164-9
- J.W. Hutchinson Z. Suo 1992 Adv. Appl. Mech. 29 63 0790.73056 10.1016/S0065-2156(08)70164-9
- (1992) Adv. Appl. Mech. , vol.29 , pp. 63
- Hutchinson, J.W.¹ Suo, Z.²

12
- 10444282137
- 10.1016/j.jallcom.2004.05.055 1:CAS:528:DC%2BD2cXhtVKqtbfE
- D.-G. Kim S.-B. Jung 2005 J. Alloy. Compd. 386 151 10.1016/j.jallcom. 2004.05.055 1:CAS:528:DC%2BD2cXhtVKqtbfE
- (2005) J. Alloy. Compd. , vol.386 , pp. 151
- Kim, D.-G.¹ Jung, S.-B.²

13
- 0001145935
- 10.1063/1.351487 1:CAS:528:DyaK38XmsVegsr0%3D 1992JAP.72.2879F
- H.P.R. Frederikse R.J. Fields A. Feldman 1992 J. Appl. Phys. 72 2879 10.1063/1.351487 1:CAS:528:DyaK38XmsVegsr0%3D 1992JAP....72.2879F
- (1992) J. Appl. Phys. , vol.72 , pp. 2879
- Frederikse, H.P.R.¹ Fields, R.J.² Feldman, A.³

14
- 0035877138
- Microstructure and intermetallic growth effects on shear and fatigue strength of solder joints subjected to thermal cycling aging
- DOI 10.1016/S0921-5093(00)01958-4, PII S0921509300019584
- H.L.J. Pang K.H. Tan X.Q. Shi Z.P. Wang 2001 Mater. Sci. Eng. 307 42 10.1016/S0921-5093(00)01958-4 (Pubitemid 32430847)
- (2001) Materials Science and Engineering A , vol.307 , Issue.1-2 , pp. 42-50
- Pang, H.L.J.¹ Tan, K.H.² Shi, X.Q.³ Wang, Z.P.⁴

15
- 0001665435
- 10.1007/s11664-998-0125-0 1:CAS:528:DyaK1cXltlKltbw%3D 1998JEMat.27.941H
- P.L. Hacke Y. Fahmy H. Conrad 1998 J. Electron. Mater. 27 941 10.1007/s11664-998-0125-0 1:CAS:528:DyaK1cXltlKltbw%3D 1998JEMat..27..941H
- (1998) J. Electron. Mater. , vol.27 , pp. 941
- Hacke, P.L.¹ Fahmy, Y.² Conrad, H.³

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