Reliability in large area solder joint assemblies and effects of thermal expansion mismatch and die size

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3582, Issue , 1998, Pages 583-590

  He, Jun ^a   Morris, W L ^a   Shaw, M C ^a   Sridhar, N ^a   Mather, J C ^a  

^a ROCKWELL SCIENCE CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIES; FINITE ELEMENT METHOD; FRACTURE; MATHEMATICAL MODELS; RAMAN SPECTROSCOPY; RELIABILITY; RESIDUAL STRESSES; SOLDERED JOINTS; THERMAL EXPANSION; THERMAL STRESS;

RAMAN PIEZOSPECTROSCOPY; THERMAL EXPANSION MISMATCH;

ELECTRONICS PACKAGING;

EID: 0032315127     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)