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Volumn 4, Issue 3, 2009, Pages

First fabrication of full 3D-detectors at SINTEF

Author keywords

Pixelated detectors and associated VLSI electronics; Solid state detectors

Indexed keywords

DETECTOR STRUCTURE; FABRICATION PROCESS; IMAGING APPLICATIONS; PRODUCTION VOLUMES; READOUT ELECTRONICS; SOLID STATE DETECTORS; STACKED DETECTORS; VLSI ELECTRONICS;

EID: 71049150053     PISSN: 17480221     EISSN: 17480221     Source Type: Journal    
DOI: 10.1088/1748-0221/4/03/P03010     Document Type: Article
Times cited : (37)

References (21)
  • 1
    • 0031209562 scopus 로고    scopus 로고
    • 3D - A proposed new architecture for solid-state radiation detectors
    • S.I. Parker, C.J. Kenney and J. Segal 1997 3D - A proposed new architecture for solid-state radiation detectors, Nucl. Instrum. Meth. A 395 328
    • (1997) Nucl. Instrum. Meth. A , vol.395 , pp. 328
    • Parker, S.I.1    Kenney, C.J.2    Segal, J.3
  • 2
    • 0033311423 scopus 로고    scopus 로고
    • Silicon detectors with 3D electrode arrays: Fabrication and initial test results
    • C. Kenney, S. Parker, J. Segal and C. Storment 1999 Silicon detectors with 3D electrode arrays: fabrication and initial test results, IEEE Trans. Nucl. Sci. 46 1224
    • (1999) IEEE Trans. Nucl. Sci. , vol.46 , pp. 1224
    • Kenney, C.1    Parker, S.2    Segal, J.3    Storment, C.4
  • 3
    • 0001753935 scopus 로고    scopus 로고
    • Performance of 3D architecture, silicon sensors after intense proton irradiation
    • S. Parker and C.J. Kenney 2001 Performance of 3D architecture, silicon sensors after intense proton irradiation, IEEE Trans. Nucl. Sci. 48 1629
    • (2001) IEEE Trans. Nucl. Sci. , vol.48 , pp. 1629
    • Parker, S.1    Kenney, C.J.2
  • 4
    • 0035309527 scopus 로고    scopus 로고
    • Observation of Beta and X rays with 3D-architecture, silicon micro-strip sensors
    • C. Kenney et al. 2001 Observation of Beta and X rays with 3D-architecture, silicon micro-strip sensors, IEEE Trans. Nucl. Sci. 48 189
    • (2001) IEEE Trans. Nucl. Sci. , vol.48 , pp. 189
    • Kenney, C.1
  • 5
    • 0035723579 scopus 로고    scopus 로고
    • Results from 3D sensors with wall electrodes: Near-cell-edge sensitivity measurements as a preview of active-edge sensors
    • C.J. Kenney, S.I. Parker and E. Walckiers 2001 Results from 3D sensors with wall electrodes: near-cell-edge sensitivity measurements as a preview of active-edge sensors, IEEE Trans. Nucl. Sci. 48 2405
    • (2001) IEEE Trans. Nucl. Sci. , vol.48 , pp. 2405
    • Kenney, C.J.1    Parker, S.I.2    Walckiers, E.3
  • 6
    • 2342498573 scopus 로고    scopus 로고
    • 3dx: Micromachined silicon crystallographic x-ray detector
    • J. Morse et al. 2002 3dx: micromachined silicon crystallographic x-ray detector, Proc. SPIE 4784 365
    • (2002) Proc. SPIE , vol.4784 , pp. 365
    • Morse, J.1
  • 8
    • 33645850706 scopus 로고    scopus 로고
    • 3D detectors - State of the art
    • A. Kok et al. 2006 3D detectors - State of the art, Nucl. Instrum Meth. A 560 127
    • (2006) Nucl. Instrum Meth. A , vol.560 , pp. 127
    • Kok, A.1
  • 9
    • 0043231265 scopus 로고    scopus 로고
    • Advances in silicon detectors for particle tracking in extreme radiation environments
    • C. Da Via et. al. 2003 Advances in silicon detectors for particle tracking in extreme radiation environments, Nucl. Instrum. Meth. A 509 86
    • (2003) Nucl. Instrum. Meth. A , vol.509 , pp. 86
    • Da Via, C.1
  • 10
    • 84876637303 scopus 로고    scopus 로고
    • Interconnect layer with advanced multiple feedthrough metallization for an integrated microphone for hearing applications
    • talk June 7-10, Sendai, Japan
    • M. Heschel et al. 1999 Interconnect layer with advanced multiple feedthrough metallization for an integrated microphone for hearing applications, talk at the Transducers'99 - 10th International Conference on Solid-State Sensors and Actuators, June 7-10, Sendai, Japan
    • (1999) Transducers'99 - 10th International Conference on Solid-State Sensors and Actuators
    • Heschel, M.1
  • 11
    • 17444454331 scopus 로고    scopus 로고
    • Interconnects for a multi-layer three-dimensional silicon architecture
    • May
    • K.J. Herrick, L.P.B. Katehi and R.T. Kihm Interconnects for a multi-layer three-dimensional silicon architecture, Microw. J. (May 2001) 284
    • (2001) Microw. J. , pp. 284
    • Herrick, K.J.1    Katehi, L.P.B.2    Kihm, R.T.3
  • 12
    • 33747158200 scopus 로고    scopus 로고
    • Active-edge planar radiation sensors
    • C.J. Kenney et al. 2006 Active-edge planar radiation sensors, Nucl. Instrum. Meth. A565 272
    • (2006) Nucl. Instrum. Meth. , vol.A565 , pp. 272
    • Kenney, C.J.1
  • 15
    • 34247557694 scopus 로고    scopus 로고
    • Development of cost effective high density through wafer interconnects for 3D microsystems
    • N. Lietaer, P. Storaas, L. Brevik and S. Moe 2006 Development of cost effective high density through wafer interconnects for 3D microsystems, J. Micromech. Microeng. 16 S29
    • (2006) J. Micromech. Microeng. , vol.16 , pp. 29
    • Lietaer, N.1    Storaas, P.2    Brevik, L.3    Moe, S.4
  • 16
    • 84888304523 scopus 로고    scopus 로고
    • Alcatel AMS-200, http://www.alcatelmicromachining.com
    • Alcatel AMS-200
  • 20
    • 40849136042 scopus 로고    scopus 로고
    • Radiation hardness properties of full-3D active edge silicon sensors
    • C. Da Via et al. 2008 Radiation hardness properties of full-3D active edge silicon sensors, Nucl. Instrum. Meth. A 587 243
    • (2008) Nucl. Instrum. Meth. A , vol.587 , pp. 243
    • Da Via, C.1
  • 21
    • 71049153432 scopus 로고    scopus 로고
    • January 9, CERN, Geneva, Switzerland
    • S.J Watts 2009 3D detector simulation, talk at the 3D ATLAS Pixel Meeting, January 9, CERN, Geneva, Switzerland
    • (2009) 3D Detector Simulation
    • Watts, S.J.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.