Packaging of radiation and particle detectors

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 310-314

  Fritzsch, T ^a   Jordan, R ^a   Glaw, V ^a   Topper M ^a   Dietrich, L ^a   Wolf, J ^a   Ehrmann, O ^a   Oppermann, H ^a   Reichl, H ^a   Wermes, N ^b  

^a FRAUNHOFER IZM   (Germany)

^b UNIVERSITY OF BONN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP PROCESSING; INTERCONNECTION BUMPS; MULTICHIP MODULE (MCM) CONCEPTS; PIXEL DETECTOR MODULES;

COLLIDING BEAM ACCELERATORS; DIAGNOSIS; IMAGING SYSTEMS; MICROPROCESSOR CHIPS; PARTICLE DETECTORS; SEMICONDUCTOR DEVICES; X RAY ANALYSIS;

CHIP SCALE PACKAGES;

EID: 33845562295     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645664     Document Type: Conference Paper

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