Junction-level thermal extraction and simulation of 3DICs

2009 IEEE International Conference on 3D System Integration, 3DIC 2009

Volumn , Issue , 2009, Pages

  Melamed, Samson ^a   Thorolfsson, Thorlindur ^a   Srinivasany, Adi ^b   Chengy, Edmund ^b   Franzon, Paul ^a   Davis, Rhett ^a  

^a North Carolina State University   (United States)

^b Gradient Design Automation Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; 3D THERMAL ANALYSIS; ACTIVE DEVICES; CLOCK BUFFER; FFT PROCESSORS; HEAT DENSITY; SPATIAL RESOLUTION; THERMAL EXTRACTION; THERMAL PATHS;

FAST FOURIER TRANSFORMS; FLUORINE CONTAINING POLYMERS; IMAGING SYSTEMS; SYNTHETIC APERTURE RADAR; SYNTHETIC APERTURES; THERMAL CONDUCTIVITY; THERMOANALYSIS;

THREE DIMENSIONAL;

EID: 70549092974     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/3DIC.2009.5306529     Document Type: Conference Paper

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