Electrodeposition of Sn-Cu solder alloy for electronics interconnection

2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

Volumn , Issue , 2009, Pages 772-777

  Qin, Yi ^a   Wassay, Abdul ^a   Liu, Changqing ^a   Wilcox, G D ^a   Zhao, Kun ^b   Wang, Changhai ^b  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

^b HERIOT WATT UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

BIPHASIC STRUCTURE; CU ALLOY; DEPOSITED FILMS; ELECTROPLATED FILMS; FINE PITCH; LEAD FREE SOLDERS; METHANESULPHONIC ACID; NEAR-EUTECTIC COMPOSITION; SEM; SN-CU SOLDERS; TEST WAFERS; TRITON X-100;

ALLOYS; COPPER ALLOYS; ELECTRODEPOSITION; ELECTRONICS PACKAGING; ETHANOL; EUTECTICS; LEAD; PACKAGING; SCANNING ELECTRON MICROSCOPY; SURFACE ACTIVE AGENTS; TIN ALLOYS; X RAY DIFFRACTION;

TIN;

EID: 70449972497     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2009.5270643     Document Type: Conference Paper

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