Electrodeposition of Sn-Ag solder alloy for electronics interconnection

Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC

Volumn , Issue , 2008, Pages 833-837

  Qin, Yi ^a   Wilcox, G D ^a   Liu, Changqing ^a  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOYS; BRAZING; ELECTROCHEMISTRY; ETHYLENE GLYCOL; EUTECTICS; GLYCOLS; LEAD; POLYETHYLENE GLYCOLS; POLYETHYLENE OXIDES; SCANNING ELECTRON MICROSCOPY; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; SURFACE ACTIVE AGENTS; TIN ALLOYS; WELDING;

BIPHASIC STRUCTURES; DEPOSITED FILMS; ELECTROPLATED FILMS; EUTECTIC COMPOSITIONS; FLIP CHIPS; LEAD-FREE SOLDERS; SOLDER ALLOYS; X-RAY DIFFRACTIONS;

TIN;

EID: 58149099218     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2008.4684460     Document Type: Conference Paper

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